JPH0354199B2 - - Google Patents
Info
- Publication number
- JPH0354199B2 JPH0354199B2 JP60219026A JP21902685A JPH0354199B2 JP H0354199 B2 JPH0354199 B2 JP H0354199B2 JP 60219026 A JP60219026 A JP 60219026A JP 21902685 A JP21902685 A JP 21902685A JP H0354199 B2 JPH0354199 B2 JP H0354199B2
- Authority
- JP
- Japan
- Prior art keywords
- nickel
- parts
- weight
- solution
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 81
- 229910052759 nickel Inorganic materials 0.000 claims description 34
- 238000005530 etching Methods 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 22
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 16
- 229910017604 nitric acid Inorganic materials 0.000 claims description 16
- KBJMLQFLOWQJNF-UHFFFAOYSA-N nickel(ii) nitrate Chemical compound [Ni+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O KBJMLQFLOWQJNF-UHFFFAOYSA-N 0.000 claims description 10
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 8
- KHIWWQKSHDUIBK-UHFFFAOYSA-N periodic acid Chemical compound OI(=O)(=O)=O KHIWWQKSHDUIBK-UHFFFAOYSA-N 0.000 claims description 7
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims description 6
- 150000001413 amino acids Chemical class 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 5
- IQPQPXUDXQDVMK-UHFFFAOYSA-N 3-(3-fluorophenyl)-3-[(2-methylpropan-2-yl)oxycarbonylamino]propanoic acid Chemical compound CC(C)(C)OC(=O)NC(CC(O)=O)C1=CC=CC(F)=C1 IQPQPXUDXQDVMK-UHFFFAOYSA-N 0.000 claims description 4
- XPFAJCSMHOQBQB-UHFFFAOYSA-N 2-aminoacetic acid;nitric acid Chemical compound O[N+]([O-])=O.NCC(O)=O XPFAJCSMHOQBQB-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 239000004471 Glycine Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 2
- 230000000717 retained effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 239000000243 solution Substances 0.000 description 33
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000005484 gravity Effects 0.000 description 5
- 229910052736 halogen Inorganic materials 0.000 description 5
- 150000002367 halogens Chemical class 0.000 description 5
- 229910052740 iodine Inorganic materials 0.000 description 5
- 239000011630 iodine Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002585 base Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000003637 basic solution Substances 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- TWLXDPFBEPBAQB-UHFFFAOYSA-N orthoperiodic acid Chemical compound OI(O)(O)(O)(O)=O TWLXDPFBEPBAQB-UHFFFAOYSA-N 0.000 description 2
- 238000006557 surface reaction Methods 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000004480 active ingredient Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- BGTFCAQCKWKTRL-YDEUACAXSA-N chembl1095986 Chemical compound C1[C@@H](N)[C@@H](O)[C@H](C)O[C@H]1O[C@@H]([C@H]1C(N[C@H](C2=CC(O)=CC(O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O)=C2C=2C(O)=CC=C(C=2)[C@@H](NC(=O)[C@@H]2NC(=O)[C@@H]3C=4C=C(C(=C(O)C=4)C)OC=4C(O)=CC=C(C=4)[C@@H](N)C(=O)N[C@@H](C(=O)N3)[C@H](O)C=3C=CC(O4)=CC=3)C(=O)N1)C(O)=O)=O)C(C=C1)=CC=C1OC1=C(O[C@@H]3[C@H]([C@H](O)[C@@H](O)[C@H](CO[C@@H]5[C@H]([C@@H](O)[C@H](O)[C@@H](C)O5)O)O3)O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O[C@@H]3[C@H]([C@H](O)[C@@H](CO)O3)O)C4=CC2=C1 BGTFCAQCKWKTRL-YDEUACAXSA-N 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- ICIWUVCWSCSTAQ-UHFFFAOYSA-M iodate Chemical compound [O-]I(=O)=O ICIWUVCWSCSTAQ-UHFFFAOYSA-M 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002085 persistent effect Effects 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/28—Acidic compositions for etching iron group metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US661143 | 1984-10-15 | ||
| US06/661,143 US4556449A (en) | 1984-10-15 | 1984-10-15 | Nickel etching process and solution |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61174389A JPS61174389A (ja) | 1986-08-06 |
| JPH0354199B2 true JPH0354199B2 (enExample) | 1991-08-19 |
Family
ID=24652395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60219026A Granted JPS61174389A (ja) | 1984-10-15 | 1985-10-01 | ニツケルエツチング方法及び溶液 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4556449A (enExample) |
| JP (1) | JPS61174389A (enExample) |
| CA (1) | CA1215301A (enExample) |
| DE (1) | DE3536705A1 (enExample) |
| FR (1) | FR2571744A1 (enExample) |
| GB (1) | GB2165495B (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0182306B1 (en) * | 1984-11-17 | 1991-07-24 | Daikin Industries, Limited | Etchant composition |
| US4664763A (en) * | 1985-05-08 | 1987-05-12 | M&T Chemicals Inc. | Process for stripping nickel or nickel-alloy plating in a chromic acid solution |
| US4832790A (en) * | 1986-04-11 | 1989-05-23 | Advanced Tool Technologies, Inc. | Method of making metal molds and dies |
| SE8903452D0 (sv) * | 1989-10-19 | 1989-10-19 | Lars Aake Hilmer Haakansson | Foerfarande foer betning av jaern och staalytor |
| US5575885A (en) * | 1993-12-14 | 1996-11-19 | Kabushiki Kaisha Toshiba | Copper-based metal polishing solution and method for manufacturing semiconductor device |
| US5560840A (en) * | 1994-12-19 | 1996-10-01 | International Business Machines Corporation | Selective etching of nickle/iron alloys |
| US20040140288A1 (en) * | 1996-07-25 | 2004-07-22 | Bakul Patel | Wet etch of titanium-tungsten film |
| AU3661997A (en) * | 1996-07-25 | 1998-02-20 | Ekc Technology, Inc. | Chemical mechanical polishing composition and process |
| US20040134873A1 (en) * | 1996-07-25 | 2004-07-15 | Li Yao | Abrasive-free chemical mechanical polishing composition and polishing process containing same |
| US6627553B1 (en) * | 1998-11-27 | 2003-09-30 | Showa Denko K.K. | Composition for removing side wall and method of removing side wall |
| US6638326B2 (en) * | 2001-09-25 | 2003-10-28 | Ekc Technology, Inc. | Compositions for chemical mechanical planarization of tantalum and tantalum nitride |
| US6793838B2 (en) * | 2001-09-28 | 2004-09-21 | United Technologies Corporation | Chemical milling process and solution for cast titanium alloys |
| US6866792B2 (en) * | 2001-12-12 | 2005-03-15 | Ekc Technology, Inc. | Compositions for chemical mechanical planarization of copper |
| JP5645188B2 (ja) * | 2011-01-13 | 2014-12-24 | 独立行政法人産業技術総合研究所 | 無電解ニッケル合金膜のパターニング方法 |
| US20150162213A1 (en) * | 2012-05-11 | 2015-06-11 | Advanced Technology Materials, Inc. | Formulations for wet etching nipt during silicide fabrication |
| JP6646258B2 (ja) * | 2016-02-26 | 2020-02-14 | 住友金属鉱山株式会社 | 積層体のエッチング方法とそれを用いたプリント配線基板の製造方法 |
| CN114892171B (zh) * | 2022-03-24 | 2023-11-24 | 西北工业大学宁波研究院 | 一种山脉状表面结构镍基材料的制备方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3232802A (en) * | 1963-03-11 | 1966-02-01 | North American Aviation Inc | Process of etching and etching bath for nickel base alloys |
| JPS53100141A (en) * | 1977-02-14 | 1978-09-01 | Furukawa Electric Co Ltd:The | Treating solution for chemical dissolution of metal |
| DD148067A1 (de) * | 1979-12-19 | 1981-05-06 | Martin Schneider | Verfahren zur herstellung einer aetzfluessigkeit |
| US4302246A (en) * | 1980-01-03 | 1981-11-24 | Enthone, Incorporated | Solution and method for selectively stripping alloys containing nickel with gold, phosphorous or chromium from stainless steel and related nickel base alloys |
| BE888317A (fr) * | 1981-04-07 | 1981-07-31 | Enthone | Procede et solution pour enlever selectivement par decapage des alliages contenant du nickel et de l'or du phosphore ou du chrome de substrats en acier inoxydable et d'alliages de nickel |
| CA1209886A (en) * | 1982-01-11 | 1986-08-19 | Thomas W. Bleeks | Peroxide selective stripping compositions and method |
-
1984
- 1984-10-15 US US06/661,143 patent/US4556449A/en not_active Expired - Fee Related
-
1985
- 1985-09-13 CA CA000490672A patent/CA1215301A/en not_active Expired
- 1985-10-01 JP JP60219026A patent/JPS61174389A/ja active Granted
- 1985-10-11 GB GB08525093A patent/GB2165495B/en not_active Expired
- 1985-10-14 FR FR8515193A patent/FR2571744A1/fr not_active Withdrawn
- 1985-10-15 DE DE19853536705 patent/DE3536705A1/de not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61174389A (ja) | 1986-08-06 |
| GB8525093D0 (en) | 1985-11-13 |
| US4556449A (en) | 1985-12-03 |
| FR2571744A1 (fr) | 1986-04-18 |
| CA1215301A (en) | 1986-12-16 |
| GB2165495A (en) | 1986-04-16 |
| GB2165495B (en) | 1987-11-04 |
| DE3536705A1 (de) | 1986-04-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0354199B2 (enExample) | ||
| JP2001140084A (ja) | ニッケルまたはニッケル合金のエッチング液 | |
| US4632727A (en) | Copper etching process and solution | |
| US4695348A (en) | Copper etching process and product | |
| JP5360703B2 (ja) | エッチング液 | |
| US3341384A (en) | Dissolution of metal with acidified hydrogen peroxide containing dibasic acid | |
| JPH0480117B2 (enExample) | ||
| JP2005105410A (ja) | 銅エッチング液及びエッチング方法 | |
| US4919752A (en) | Bath solution and process for the removal of lead/tim, lead or tin coatings from copper or nickel surfaces | |
| JP4471094B2 (ja) | チタンまたはチタン合金のエッチング液 | |
| JP4355201B2 (ja) | タングステン金属除去液及びそれを用いたタングステン金属の除去方法 | |
| US4130455A (en) | Dissolution of metals-utilizing H2 O2 -H2 SO4 -thiosulfate etchant | |
| JP4535232B2 (ja) | チタンまたはチタン合金のエッチング液 | |
| EP0257058B1 (en) | Process for regenerating solder stripping solutions | |
| US4767661A (en) | Copper etching process and product | |
| US4140646A (en) | Dissolution of metals with a selenium catalyzed H2 O2 -H2 SO4 etchant containing t-butyl hydroperoxide | |
| US4158593A (en) | Dissolution of metals utilizing a H2 O2 -sulfuric acid solution catalyzed with selenium compounds | |
| JP2005105411A (ja) | 銅エッチング液及びエッチング方法 | |
| US4158592A (en) | Dissolution of metals utilizing a H2 O2 -sulfuric acid solution catalyzed with ketone compounds | |
| JP4296320B2 (ja) | レジスト剥離剤組成物及びその使用方法 | |
| US4767662A (en) | Copper etching process and product | |
| US4437930A (en) | Dissolution of metals utilizing ε-caprolactam | |
| EP0221327B1 (en) | A process for etching via holes in an alumina layer | |
| US4007037A (en) | Composition and method for chemically etching copper elements | |
| US4437929A (en) | Dissolution of metals utilizing pyrrolidone |