GB2165495B - Nickel etching - Google Patents

Nickel etching

Info

Publication number
GB2165495B
GB2165495B GB08525093A GB8525093A GB2165495B GB 2165495 B GB2165495 B GB 2165495B GB 08525093 A GB08525093 A GB 08525093A GB 8525093 A GB8525093 A GB 8525093A GB 2165495 B GB2165495 B GB 2165495B
Authority
GB
United Kingdom
Prior art keywords
nickel etching
etching
nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08525093A
Other languages
English (en)
Other versions
GB8525093D0 (en
GB2165495A (en
Inventor
Norvell John Nelson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Psi Star
PSI Star Inc
Original Assignee
Psi Star
PSI Star Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Psi Star, PSI Star Inc filed Critical Psi Star
Publication of GB8525093D0 publication Critical patent/GB8525093D0/en
Publication of GB2165495A publication Critical patent/GB2165495A/en
Application granted granted Critical
Publication of GB2165495B publication Critical patent/GB2165495B/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/28—Acidic compositions for etching iron group metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
GB08525093A 1984-10-15 1985-10-11 Nickel etching Expired GB2165495B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/661,143 US4556449A (en) 1984-10-15 1984-10-15 Nickel etching process and solution

Publications (3)

Publication Number Publication Date
GB8525093D0 GB8525093D0 (en) 1985-11-13
GB2165495A GB2165495A (en) 1986-04-16
GB2165495B true GB2165495B (en) 1987-11-04

Family

ID=24652395

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08525093A Expired GB2165495B (en) 1984-10-15 1985-10-11 Nickel etching

Country Status (6)

Country Link
US (1) US4556449A (enExample)
JP (1) JPS61174389A (enExample)
CA (1) CA1215301A (enExample)
DE (1) DE3536705A1 (enExample)
FR (1) FR2571744A1 (enExample)
GB (1) GB2165495B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0182306B1 (en) * 1984-11-17 1991-07-24 Daikin Industries, Limited Etchant composition
US4664763A (en) * 1985-05-08 1987-05-12 M&T Chemicals Inc. Process for stripping nickel or nickel-alloy plating in a chromic acid solution
US4832790A (en) * 1986-04-11 1989-05-23 Advanced Tool Technologies, Inc. Method of making metal molds and dies
SE8903452D0 (sv) * 1989-10-19 1989-10-19 Lars Aake Hilmer Haakansson Foerfarande foer betning av jaern och staalytor
US5575885A (en) * 1993-12-14 1996-11-19 Kabushiki Kaisha Toshiba Copper-based metal polishing solution and method for manufacturing semiconductor device
US5560840A (en) * 1994-12-19 1996-10-01 International Business Machines Corporation Selective etching of nickle/iron alloys
US20040140288A1 (en) * 1996-07-25 2004-07-22 Bakul Patel Wet etch of titanium-tungsten film
AU3661997A (en) * 1996-07-25 1998-02-20 Ekc Technology, Inc. Chemical mechanical polishing composition and process
US20040134873A1 (en) * 1996-07-25 2004-07-15 Li Yao Abrasive-free chemical mechanical polishing composition and polishing process containing same
US6627553B1 (en) * 1998-11-27 2003-09-30 Showa Denko K.K. Composition for removing side wall and method of removing side wall
US6638326B2 (en) * 2001-09-25 2003-10-28 Ekc Technology, Inc. Compositions for chemical mechanical planarization of tantalum and tantalum nitride
US6793838B2 (en) * 2001-09-28 2004-09-21 United Technologies Corporation Chemical milling process and solution for cast titanium alloys
US6866792B2 (en) * 2001-12-12 2005-03-15 Ekc Technology, Inc. Compositions for chemical mechanical planarization of copper
JP5645188B2 (ja) * 2011-01-13 2014-12-24 独立行政法人産業技術総合研究所 無電解ニッケル合金膜のパターニング方法
US20150162213A1 (en) * 2012-05-11 2015-06-11 Advanced Technology Materials, Inc. Formulations for wet etching nipt during silicide fabrication
JP6646258B2 (ja) * 2016-02-26 2020-02-14 住友金属鉱山株式会社 積層体のエッチング方法とそれを用いたプリント配線基板の製造方法
CN114892171B (zh) * 2022-03-24 2023-11-24 西北工业大学宁波研究院 一种山脉状表面结构镍基材料的制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3232802A (en) * 1963-03-11 1966-02-01 North American Aviation Inc Process of etching and etching bath for nickel base alloys
JPS53100141A (en) * 1977-02-14 1978-09-01 Furukawa Electric Co Ltd:The Treating solution for chemical dissolution of metal
DD148067A1 (de) * 1979-12-19 1981-05-06 Martin Schneider Verfahren zur herstellung einer aetzfluessigkeit
US4302246A (en) * 1980-01-03 1981-11-24 Enthone, Incorporated Solution and method for selectively stripping alloys containing nickel with gold, phosphorous or chromium from stainless steel and related nickel base alloys
BE888317A (fr) * 1981-04-07 1981-07-31 Enthone Procede et solution pour enlever selectivement par decapage des alliages contenant du nickel et de l'or du phosphore ou du chrome de substrats en acier inoxydable et d'alliages de nickel
CA1209886A (en) * 1982-01-11 1986-08-19 Thomas W. Bleeks Peroxide selective stripping compositions and method

Also Published As

Publication number Publication date
JPS61174389A (ja) 1986-08-06
GB8525093D0 (en) 1985-11-13
US4556449A (en) 1985-12-03
FR2571744A1 (fr) 1986-04-18
CA1215301A (en) 1986-12-16
GB2165495A (en) 1986-04-16
JPH0354199B2 (enExample) 1991-08-19
DE3536705A1 (de) 1986-04-17

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee