JPH035413Y2 - - Google Patents
Info
- Publication number
- JPH035413Y2 JPH035413Y2 JP1983078037U JP7803783U JPH035413Y2 JP H035413 Y2 JPH035413 Y2 JP H035413Y2 JP 1983078037 U JP1983078037 U JP 1983078037U JP 7803783 U JP7803783 U JP 7803783U JP H035413 Y2 JPH035413 Y2 JP H035413Y2
- Authority
- JP
- Japan
- Prior art keywords
- pad
- base
- pad mounting
- mounting board
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983078037U JPS59183748U (ja) | 1983-05-24 | 1983-05-24 | 平面研削用定盤 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983078037U JPS59183748U (ja) | 1983-05-24 | 1983-05-24 | 平面研削用定盤 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59183748U JPS59183748U (ja) | 1984-12-07 |
| JPH035413Y2 true JPH035413Y2 (cg-RX-API-DMAC7.html) | 1991-02-12 |
Family
ID=30208047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983078037U Granted JPS59183748U (ja) | 1983-05-24 | 1983-05-24 | 平面研削用定盤 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59183748U (cg-RX-API-DMAC7.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995029039A1 (en) * | 1994-04-22 | 1995-11-02 | Kabushiki Kaisha Toshiba | Separation type grinding surface plate and grinding apparatus using same |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2821151B2 (ja) * | 1988-11-11 | 1998-11-05 | 株式会社日立製作所 | 硬脆材料のラッピング方法 |
| JP4680314B1 (ja) * | 2010-02-04 | 2011-05-11 | 東邦エンジニアリング株式会社 | 研磨パッド用補助板およびそれを用いた研磨パッドの再生方法 |
| JP5568745B2 (ja) * | 2010-12-08 | 2014-08-13 | 東邦エンジニアリング株式会社 | 研磨パッドの再生方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53161395U (cg-RX-API-DMAC7.html) * | 1977-05-26 | 1978-12-18 | ||
| JPS57156166A (en) * | 1981-03-20 | 1982-09-27 | Hitachi Ltd | Lapping equipment |
-
1983
- 1983-05-24 JP JP1983078037U patent/JPS59183748U/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995029039A1 (en) * | 1994-04-22 | 1995-11-02 | Kabushiki Kaisha Toshiba | Separation type grinding surface plate and grinding apparatus using same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59183748U (ja) | 1984-12-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0335063B2 (cg-RX-API-DMAC7.html) | ||
| CA2339097A1 (en) | Rotary dressing tool containing brazed diamond layer | |
| JPH035413Y2 (cg-RX-API-DMAC7.html) | ||
| JPH031172Y2 (cg-RX-API-DMAC7.html) | ||
| US4527358A (en) | Removable polishing pad assembly | |
| US6942550B2 (en) | Intermediate lens pad | |
| KR970073870A (ko) | 드레서가 부착된 편면 연마장치 | |
| JPH04179505A (ja) | 生セラミックス切削方法 | |
| JP2001121413A (ja) | 平板状の被加工材の保持方法 | |
| US4780991A (en) | Mask and pressure block for ultra thin work pieces | |
| JPH0479790B2 (cg-RX-API-DMAC7.html) | ||
| JPH0232110B2 (cg-RX-API-DMAC7.html) | ||
| CN212445861U (zh) | 适用于金刚石线切割机微型化分割的晶片载物板 | |
| JPH11320387A (ja) | 研磨パッドの貼着方法 | |
| JPS61263136A (ja) | 薄板物品の支持テ−ブル | |
| JPS6133831A (ja) | 真空吸着装置 | |
| JPS6234444Y2 (cg-RX-API-DMAC7.html) | ||
| JPH01238907A (ja) | 半導体組立治具 | |
| JPS6234690Y2 (cg-RX-API-DMAC7.html) | ||
| JPS6190868A (ja) | 研磨装置 | |
| CN207788646U (zh) | 一种用于精密陶瓷产品加工的装置 | |
| JPH06224299A (ja) | 半導体ウェーハの分割方法及び分割システム | |
| JP6624385B2 (ja) | ダイシング装置及びダイシング用ブレードのドレッシング方法 | |
| JPH0639357U (ja) | ラッピング砥石定盤 | |
| JPH0233937Y2 (cg-RX-API-DMAC7.html) |