JPH0353780B2 - - Google Patents

Info

Publication number
JPH0353780B2
JPH0353780B2 JP60018361A JP1836185A JPH0353780B2 JP H0353780 B2 JPH0353780 B2 JP H0353780B2 JP 60018361 A JP60018361 A JP 60018361A JP 1836185 A JP1836185 A JP 1836185A JP H0353780 B2 JPH0353780 B2 JP H0353780B2
Authority
JP
Japan
Prior art keywords
pellet
semiconductor
thermal stress
plated
brazed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60018361A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61177754A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP60018361A priority Critical patent/JPS61177754A/ja
Publication of JPS61177754A publication Critical patent/JPS61177754A/ja
Publication of JPH0353780B2 publication Critical patent/JPH0353780B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/20—
    • H10W72/00—
    • H10W72/30—
    • H10W72/073—
    • H10W72/07336—
    • H10W72/07636—
    • H10W72/07651—
    • H10W72/60—
    • H10W74/00—
    • H10W90/736—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP60018361A 1985-01-31 1985-01-31 樹脂封止形半導体装置 Granted JPS61177754A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60018361A JPS61177754A (ja) 1985-01-31 1985-01-31 樹脂封止形半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60018361A JPS61177754A (ja) 1985-01-31 1985-01-31 樹脂封止形半導体装置

Publications (2)

Publication Number Publication Date
JPS61177754A JPS61177754A (ja) 1986-08-09
JPH0353780B2 true JPH0353780B2 (enExample) 1991-08-16

Family

ID=11969552

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60018361A Granted JPS61177754A (ja) 1985-01-31 1985-01-31 樹脂封止形半導体装置

Country Status (1)

Country Link
JP (1) JPS61177754A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011003832A (ja) * 2009-06-22 2011-01-06 Nippon Inter Electronics Corp パワー半導体モジュール

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4569423B2 (ja) 2005-08-31 2010-10-27 株式会社日立製作所 半導体装置の製造方法
JP4875902B2 (ja) * 2006-02-08 2012-02-15 株式会社日立製作所 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011003832A (ja) * 2009-06-22 2011-01-06 Nippon Inter Electronics Corp パワー半導体モジュール

Also Published As

Publication number Publication date
JPS61177754A (ja) 1986-08-09

Similar Documents

Publication Publication Date Title
KR101194429B1 (ko) 반도체장치 및 그 제조방법
JP4492448B2 (ja) 半導体パワーモジュール
JP5656907B2 (ja) パワーモジュール
US9991220B2 (en) Semiconductor device
JPH04162756A (ja) 半導体モジュール
JP2006179538A (ja) 半導体パワーモジュール
JP3847166B2 (ja) 射出成形技術を用いて電子部品をパッケージングするデバイス
JP2005311019A (ja) 半導体パワーモジュール
KR102575288B1 (ko) 반도체 패키지 및 이의 제조방법
CN104835796A (zh) 一种无铅扩散焊的功率模块
JP6972174B2 (ja) 半導体装置および半導体装置の製造方法
JP2014053441A (ja) 半導体装置
US4604642A (en) Fe-Ni-Cu leadframe
JPH0353780B2 (enExample)
JP7495225B2 (ja) 半導体装置
JP2009147123A (ja) 半導体装置及びその製造方法
JP2000323647A (ja) モジュール型半導体装置及びその製造方法
JP2006179732A (ja) 半導体パワーモジュール
JPS60100439A (ja) 樹脂封止形半導体装置
JP2005285885A (ja) 半導体装置
JPS62136059A (ja) 樹脂封止半導体装置用リ−ドフレ−ム
JPS6129162A (ja) 半導体装置
JPS62781B2 (enExample)
JPS5952853A (ja) 半導体装置
JPS615530A (ja) 半導体装置

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term