JPH0353507Y2 - - Google Patents

Info

Publication number

JPH0353507Y2

JPH0353507Y2 JP5296287U JP5296287U JPH0353507Y2 JP H0353507 Y2 JPH0353507 Y2 JP H0353507Y2 JP 5296287 U JP5296287 U JP 5296287U JP 5296287 U JP5296287 U JP 5296287U JP H0353507 Y2 JPH0353507 Y2 JP H0353507Y2

Authority

JP

Japan

Prior art keywords

frame

glass

base

semiconductor package

semiconductor element

Prior art date

1987-04-08

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
• Discuss

• 239000011521 glass Substances 0.000 claims description 57
• 239000004065 semiconductor Substances 0.000 claims description 31
• 238000007789 sealing Methods 0.000 claims description 18
• 239000002184 metal Substances 0.000 claims description 13
• 229910052751 metal Inorganic materials 0.000 claims description 13
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 9
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
• 229910052802 copper Inorganic materials 0.000 claims description 5
• 239000010949 copper Substances 0.000 claims description 5
• 229910000881 Cu alloy Inorganic materials 0.000 claims description 4
• 238000000034 method Methods 0.000 description 6
• 238000005219 brazing Methods 0.000 description 5
• 230000017525 heat dissipation Effects 0.000 description 3
• 229910000531 Co alloy Inorganic materials 0.000 description 2
• 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
• KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 2
• 238000010586 diagram Methods 0.000 description 2
• 239000000463 material Substances 0.000 description 2
• 230000006835 compression Effects 0.000 description 1
• 238000007906 compression Methods 0.000 description 1
• 230000001010 compromised effect Effects 0.000 description 1
• 230000000593 degrading effect Effects 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 230000005669 field effect Effects 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 238000012986 modification Methods 0.000 description 1
• 230000004048 modification Effects 0.000 description 1
• 238000003825 pressing Methods 0.000 description 1
• 239000005394 sealing glass Substances 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1