JPH0352237B2 - - Google Patents
Info
- Publication number
- JPH0352237B2 JPH0352237B2 JP57205053A JP20505382A JPH0352237B2 JP H0352237 B2 JPH0352237 B2 JP H0352237B2 JP 57205053 A JP57205053 A JP 57205053A JP 20505382 A JP20505382 A JP 20505382A JP H0352237 B2 JPH0352237 B2 JP H0352237B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- insulating layer
- via hole
- active metal
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 14
- 239000004642 Polyimide Substances 0.000 claims description 6
- 229920001721 polyimide Polymers 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000002966 varnish Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims 6
- 229920005989 resin Polymers 0.000 claims 6
- 239000007769 metal material Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 23
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 239000010408 film Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20505382A JPS5994899A (ja) | 1982-11-22 | 1982-11-22 | バイアホ−ル形成法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20505382A JPS5994899A (ja) | 1982-11-22 | 1982-11-22 | バイアホ−ル形成法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5994899A JPS5994899A (ja) | 1984-05-31 |
JPH0352237B2 true JPH0352237B2 (fr) | 1991-08-09 |
Family
ID=16500660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20505382A Granted JPS5994899A (ja) | 1982-11-22 | 1982-11-22 | バイアホ−ル形成法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5994899A (fr) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56111296A (en) * | 1980-02-08 | 1981-09-02 | Tokyo Shibaura Electric Co | Method of forming multilayer wire |
-
1982
- 1982-11-22 JP JP20505382A patent/JPS5994899A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56111296A (en) * | 1980-02-08 | 1981-09-02 | Tokyo Shibaura Electric Co | Method of forming multilayer wire |
Also Published As
Publication number | Publication date |
---|---|
JPS5994899A (ja) | 1984-05-31 |
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