JPH0352234B2 - - Google Patents
Info
- Publication number
- JPH0352234B2 JPH0352234B2 JP57229349A JP22934982A JPH0352234B2 JP H0352234 B2 JPH0352234 B2 JP H0352234B2 JP 57229349 A JP57229349 A JP 57229349A JP 22934982 A JP22934982 A JP 22934982A JP H0352234 B2 JPH0352234 B2 JP H0352234B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- conductive
- wiring pattern
- printing
- resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003973 paint Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000003685 thermal hair damage Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22934982A JPS59119892A (ja) | 1982-12-27 | 1982-12-27 | 電気回路用ベ−ス基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22934982A JPS59119892A (ja) | 1982-12-27 | 1982-12-27 | 電気回路用ベ−ス基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59119892A JPS59119892A (ja) | 1984-07-11 |
| JPH0352234B2 true JPH0352234B2 (da) | 1991-08-09 |
Family
ID=16890767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22934982A Granted JPS59119892A (ja) | 1982-12-27 | 1982-12-27 | 電気回路用ベ−ス基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59119892A (da) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0220777Y2 (da) * | 1986-03-27 | 1990-06-06 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4843162A (da) * | 1971-10-02 | 1973-06-22 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4858945U (da) * | 1971-11-09 | 1973-07-26 |
-
1982
- 1982-12-27 JP JP22934982A patent/JPS59119892A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4843162A (da) * | 1971-10-02 | 1973-06-22 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59119892A (ja) | 1984-07-11 |
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