JPH0349729B2 - - Google Patents

Info

Publication number
JPH0349729B2
JPH0349729B2 JP60231728A JP23172885A JPH0349729B2 JP H0349729 B2 JPH0349729 B2 JP H0349729B2 JP 60231728 A JP60231728 A JP 60231728A JP 23172885 A JP23172885 A JP 23172885A JP H0349729 B2 JPH0349729 B2 JP H0349729B2
Authority
JP
Japan
Prior art keywords
mold
molding
lead frame
fixed
movable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60231728A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6290213A (ja
Inventor
Mitsuhiro Obara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP23172885A priority Critical patent/JPS6290213A/ja
Publication of JPS6290213A publication Critical patent/JPS6290213A/ja
Publication of JPH0349729B2 publication Critical patent/JPH0349729B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP23172885A 1985-10-17 1985-10-17 集積回路素子ケ−シングの射出成形による成形方法 Granted JPS6290213A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23172885A JPS6290213A (ja) 1985-10-17 1985-10-17 集積回路素子ケ−シングの射出成形による成形方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23172885A JPS6290213A (ja) 1985-10-17 1985-10-17 集積回路素子ケ−シングの射出成形による成形方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP18835890A Division JPH0381126A (ja) 1990-07-17 1990-07-17 集積回路素子ケーシングの射出成形装置

Publications (2)

Publication Number Publication Date
JPS6290213A JPS6290213A (ja) 1987-04-24
JPH0349729B2 true JPH0349729B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-07-30

Family

ID=16928095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23172885A Granted JPS6290213A (ja) 1985-10-17 1985-10-17 集積回路素子ケ−シングの射出成形による成形方法

Country Status (1)

Country Link
JP (1) JPS6290213A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2659157B2 (fr) * 1989-05-26 1994-09-30 Lemaire Gerard Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede.
US5876765A (en) * 1995-11-09 1999-03-02 Micron Technology, Inc. Injection molding equipment for encapsulating semiconductor die and the like
KR100214555B1 (ko) * 1997-02-14 1999-08-02 구본준 반도체 패키지의 제조방법
DE10341501A1 (de) * 2003-09-05 2005-03-31 Robert Bosch Gmbh Verfahren zur Herstellung von Kunststoffteilen mit integrierten Leiterbahnen

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5935775B2 (ja) * 1977-03-31 1984-08-30 三菱レイヨン株式会社 合成樹脂装飾体の製造方法
JPS58147331A (ja) * 1982-02-26 1983-09-02 Matsushita Electric Works Ltd インサ−ト成形法

Also Published As

Publication number Publication date
JPS6290213A (ja) 1987-04-24

Similar Documents

Publication Publication Date Title
US4480975A (en) Apparatus for encapsulating electronic components
JP3515399B2 (ja) ３つ以上の半成形品からなる成形品の成形方法および成形用金型
JPH0751321B2 (ja) 微小部品の組立成形方法
JPH0349729B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP3665596B2 (ja) メモリーカードの製造方法
JPH0525655B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
GB2104827A (en) Molding of electronic components
JP3398623B2 (ja) 電子部品の成形方法
JPH0825860A (ja) 回路基板の一体成形方法
JPH0356050Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP3350581B2 (ja) 金型内振動加工方法及び装置
JPH0353502Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH01138724A (ja) 半導体装置のモールド方法および装置
JP2801899B2 (ja) 半導体チップパッケージの保護胴体を形成するための金型
JP2683204B2 (ja) 樹脂パッケージング方法及びその装置
JPH08142145A (ja) 射出成形用金型及びそれを用いた射出圧縮成形法
JP4086534B2 (ja) メモリーカードとその成形方法
JP2001024016A (ja) 半導体パッケージのための樹脂封止装置
JP3404187B2 (ja) モールド金型の離型装置
JP2525487Y2 (ja) モールド金型
US6911719B1 (en) Lead frame for resin sealed semiconductor device
JPH0153501B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2675503B2 (ja) 射出成形用樹脂型及び型装置
JP4548966B2 (ja) 電子部品の樹脂封止装置
JP3602422B2 (ja) 樹脂封止装置