JPH0347579B2 - - Google Patents

Info

Publication number
JPH0347579B2
JPH0347579B2 JP58203879A JP20387983A JPH0347579B2 JP H0347579 B2 JPH0347579 B2 JP H0347579B2 JP 58203879 A JP58203879 A JP 58203879A JP 20387983 A JP20387983 A JP 20387983A JP H0347579 B2 JPH0347579 B2 JP H0347579B2
Authority
JP
Japan
Prior art keywords
bonding
added
wire
elements
strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58203879A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6095954A (ja
Inventor
Shozo Hayashi
Shinji Shirakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP58203879A priority Critical patent/JPS6095954A/ja
Publication of JPS6095954A publication Critical patent/JPS6095954A/ja
Publication of JPH0347579B2 publication Critical patent/JPH0347579B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/43—Manufacturing methods
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
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    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP58203879A 1983-10-31 1983-10-31 半導体素子のボンデイング用Ａｌ線 Granted JPS6095954A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58203879A JPS6095954A (ja) 1983-10-31 1983-10-31 半導体素子のボンデイング用Ａｌ線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58203879A JPS6095954A (ja) 1983-10-31 1983-10-31 半導体素子のボンデイング用Ａｌ線

Publications (2)

Publication Number Publication Date
JPS6095954A JPS6095954A (ja) 1985-05-29
JPH0347579B2 true JPH0347579B2 (enrdf_load_stackoverflow) 1991-07-19

Family

ID=16481225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58203879A Granted JPS6095954A (ja) 1983-10-31 1983-10-31 半導体素子のボンデイング用Ａｌ線

Country Status (1)

Country Link
JP (1) JPS6095954A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60198851A (ja) * 1984-03-23 1985-10-08 Hitachi Ltd 半導体用高耐食高硬度ボール付アルミニウム合金ワイヤ
US5711858A (en) * 1994-04-12 1998-01-27 International Business Machines Corporation Process for depositing a conductive thin film upon an integrated circuit substrate

Also Published As

Publication number Publication date
JPS6095954A (ja) 1985-05-29

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