JPH0346512B2 - - Google Patents
Info
- Publication number
- JPH0346512B2 JPH0346512B2 JP61076106A JP7610686A JPH0346512B2 JP H0346512 B2 JPH0346512 B2 JP H0346512B2 JP 61076106 A JP61076106 A JP 61076106A JP 7610686 A JP7610686 A JP 7610686A JP H0346512 B2 JPH0346512 B2 JP H0346512B2
- Authority
- JP
- Japan
- Prior art keywords
- formula
- polyimide
- polymaleimide
- bismaleimide
- adhesive film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920001721 polyimide Polymers 0.000 claims description 17
- 239000004642 Polyimide Substances 0.000 claims description 16
- 239000002313 adhesive film Substances 0.000 claims description 13
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 239000011342 resin composition Substances 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- 238000005266 casting Methods 0.000 claims description 2
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 14
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 8
- 229920003192 poly(bis maleimide) Polymers 0.000 description 8
- 239000002966 varnish Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000013557 residual solvent Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- PUKLCKVOVCZYKF-UHFFFAOYSA-N 1-[2-(2,5-dioxopyrrol-1-yl)ethyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CCN1C(=O)C=CC1=O PUKLCKVOVCZYKF-UHFFFAOYSA-N 0.000 description 1
- LNAIBNHJQKDBNR-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)-2-methylphenyl]pyrrole-2,5-dione Chemical compound CC1=C(N2C(C=CC2=O)=O)C=CC=C1N1C(=O)C=CC1=O LNAIBNHJQKDBNR-UHFFFAOYSA-N 0.000 description 1
- FJKKJQRXSPFNPM-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)-4-methylphenyl]pyrrole-2,5-dione Chemical compound CC1=CC=C(N2C(C=CC2=O)=O)C=C1N1C(=O)C=CC1=O FJKKJQRXSPFNPM-UHFFFAOYSA-N 0.000 description 1
- IPJGAEWUPXWFPL-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(N2C(C=CC2=O)=O)=C1 IPJGAEWUPXWFPL-UHFFFAOYSA-N 0.000 description 1
- AQGZJQNZNONGKY-UHFFFAOYSA-N 1-[4-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=C(N2C(C=CC2=O)=O)C=C1 AQGZJQNZNONGKY-UHFFFAOYSA-N 0.000 description 1
- PYVHLZLQVWXBDZ-UHFFFAOYSA-N 1-[6-(2,5-dioxopyrrol-1-yl)hexyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CCCCCCN1C(=O)C=CC1=O PYVHLZLQVWXBDZ-UHFFFAOYSA-N 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N 2,4-diaminotoluene Chemical compound CC1=CC=C(N)C=C1N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 239000012024 dehydrating agents Substances 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012772 electrical insulation material Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 238000006798 ring closing metathesis reaction Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Adhesive Tapes (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7610686A JPS62232475A (ja) | 1986-04-02 | 1986-04-02 | 熱硬化性接着フイルム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7610686A JPS62232475A (ja) | 1986-04-02 | 1986-04-02 | 熱硬化性接着フイルム |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7322489A Division JPH0671139B2 (ja) | 1989-03-24 | 1989-03-24 | 印刷配線板用基板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62232475A JPS62232475A (ja) | 1987-10-12 |
| JPH0346512B2 true JPH0346512B2 (de) | 1991-07-16 |
Family
ID=13595639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7610686A Granted JPS62232475A (ja) | 1986-04-02 | 1986-04-02 | 熱硬化性接着フイルム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62232475A (de) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4826927A (en) * | 1986-01-13 | 1989-05-02 | Ciba-Geigy Corporation | Mixtures containing polymides alkenyphenols and either epoxide group-free adducts or another polyimide |
| EP0456515B1 (de) * | 1990-05-10 | 1995-11-08 | Hitachi Chemical Co., Ltd. | Polyimide und diese enthaltende wärmehärtbare Harzzusammensetzungen |
| JP2007197590A (ja) * | 2006-01-27 | 2007-08-09 | Fujifilm Corp | フィルムの製造方法およびフィルム |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS518976A (de) * | 1974-06-10 | 1976-01-24 | Arvin Ind Inc | |
| JPS5211688A (en) * | 1975-07-15 | 1977-01-28 | Matsushita Electric Works Ltd | Shoulder patting device |
| JPS5324640A (en) * | 1976-08-19 | 1978-03-07 | Heraeus Quarzschmelze | Cooling infrared ray radiating element |
| JPS56161457A (en) * | 1980-05-17 | 1981-12-11 | Kanegafuchi Chem Ind Co Ltd | Heat-resisting resin composition |
-
1986
- 1986-04-02 JP JP7610686A patent/JPS62232475A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS518976A (de) * | 1974-06-10 | 1976-01-24 | Arvin Ind Inc | |
| JPS5211688A (en) * | 1975-07-15 | 1977-01-28 | Matsushita Electric Works Ltd | Shoulder patting device |
| JPS5324640A (en) * | 1976-08-19 | 1978-03-07 | Heraeus Quarzschmelze | Cooling infrared ray radiating element |
| JPS56161457A (en) * | 1980-05-17 | 1981-12-11 | Kanegafuchi Chem Ind Co Ltd | Heat-resisting resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62232475A (ja) | 1987-10-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4985509A (en) | Heat curable resin composition | |
| JPH0312105B2 (de) | ||
| EP0456515B1 (de) | Polyimide und diese enthaltende wärmehärtbare Harzzusammensetzungen | |
| US6068932A (en) | Thermosetting resin composition | |
| JPH0312592B2 (de) | ||
| JPH0346512B2 (de) | ||
| JP2757588B2 (ja) | 熱硬化性樹脂組成物及びフィルム状接着剤 | |
| JPS62235382A (ja) | 熱硬化性接着フイルム | |
| JP3493363B2 (ja) | 新規な共重合体とその製造方法 | |
| JPS6195030A (ja) | ポリイミドフイルムの製造方法 | |
| JP2606390B2 (ja) | ポリイミド接着シート及びその製造法 | |
| JP3010871B2 (ja) | 熱硬化性樹脂組成物 | |
| JP2957732B2 (ja) | 新規なポリイミド及びその製造法 | |
| JP3463111B2 (ja) | 新規な共重合体とその製造方法 | |
| JP2957738B2 (ja) | 熱硬化性樹脂組成物 | |
| JP3456256B2 (ja) | ポリイミド共重合体及びその製造方法 | |
| JP2751253B2 (ja) | 熱硬化可能な樹脂組成物、フィルム及び接着剤 | |
| JPH0671138B2 (ja) | 印刷配線板用基板の製造法 | |
| JPH0671139B2 (ja) | 印刷配線板用基板の製造法 | |
| JPH07119087B2 (ja) | フレキシブル両面金属張り積層板の製造法 | |
| JPH01123831A (ja) | 耐熱性樹脂組成物 | |
| JP3329861B2 (ja) | 耐熱積層材の製造方法 | |
| JPH10152558A (ja) | 結晶性ポリイミドの製造方法 | |
| JP3144013B2 (ja) | 新規なポリイミド及びその製造法 | |
| JP3249854B2 (ja) | 耐熱積層材用化合物及び耐熱積層材の製造方法 |