JPH0346504Y2 - - Google Patents
Info
- Publication number
- JPH0346504Y2 JPH0346504Y2 JP1985108643U JP10864385U JPH0346504Y2 JP H0346504 Y2 JPH0346504 Y2 JP H0346504Y2 JP 1985108643 U JP1985108643 U JP 1985108643U JP 10864385 U JP10864385 U JP 10864385U JP H0346504 Y2 JPH0346504 Y2 JP H0346504Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- wire bonding
- semiconductor chips
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 21
- 239000011247 coating layer Substances 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985108643U JPH0346504Y2 (US06373033-20020416-M00071.png) | 1985-07-16 | 1985-07-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985108643U JPH0346504Y2 (US06373033-20020416-M00071.png) | 1985-07-16 | 1985-07-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6217182U JPS6217182U (US06373033-20020416-M00071.png) | 1987-02-02 |
| JPH0346504Y2 true JPH0346504Y2 (US06373033-20020416-M00071.png) | 1991-10-01 |
Family
ID=30986026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985108643U Expired JPH0346504Y2 (US06373033-20020416-M00071.png) | 1985-07-16 | 1985-07-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0346504Y2 (US06373033-20020416-M00071.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5211551B2 (US06373033-20020416-M00071.png) * | 1971-08-18 | 1977-03-31 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5211551U (US06373033-20020416-M00071.png) * | 1975-07-15 | 1977-01-26 | ||
| JPS5696641U (US06373033-20020416-M00071.png) * | 1979-12-22 | 1981-07-31 |
-
1985
- 1985-07-16 JP JP1985108643U patent/JPH0346504Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5211551B2 (US06373033-20020416-M00071.png) * | 1971-08-18 | 1977-03-31 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6217182U (US06373033-20020416-M00071.png) | 1987-02-02 |
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