JPH0345908B2 - - Google Patents
Info
- Publication number
- JPH0345908B2 JPH0345908B2 JP4294584A JP4294584A JPH0345908B2 JP H0345908 B2 JPH0345908 B2 JP H0345908B2 JP 4294584 A JP4294584 A JP 4294584A JP 4294584 A JP4294584 A JP 4294584A JP H0345908 B2 JPH0345908 B2 JP H0345908B2
- Authority
- JP
- Japan
- Prior art keywords
- resin film
- wiring board
- conductor circuit
- adhesive
- flexible wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 63
- 239000011347 resin Substances 0.000 claims description 63
- 239000004020 conductor Substances 0.000 claims description 46
- 239000000853 adhesive Substances 0.000 claims description 22
- 230000001070 adhesive effect Effects 0.000 claims description 22
- 238000005530 etching Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000003754 machining Methods 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 description 9
- 230000001681 protective effect Effects 0.000 description 7
- 239000004642 Polyimide Substances 0.000 description 6
- 238000007731 hot pressing Methods 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004962 Polyamide-imide Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920002312 polyamide-imide Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4294584A JPS60189285A (ja) | 1984-03-08 | 1984-03-08 | フレキシブル配線板およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4294584A JPS60189285A (ja) | 1984-03-08 | 1984-03-08 | フレキシブル配線板およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60189285A JPS60189285A (ja) | 1985-09-26 |
| JPH0345908B2 true JPH0345908B2 (enrdf_load_stackoverflow) | 1991-07-12 |
Family
ID=12650146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4294584A Granted JPS60189285A (ja) | 1984-03-08 | 1984-03-08 | フレキシブル配線板およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60189285A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0414949Y2 (enrdf_load_stackoverflow) * | 1984-12-29 | 1992-04-03 |
-
1984
- 1984-03-08 JP JP4294584A patent/JPS60189285A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60189285A (ja) | 1985-09-26 |
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