JPH0345908B2 - - Google Patents
Info
- Publication number
- JPH0345908B2 JPH0345908B2 JP4294584A JP4294584A JPH0345908B2 JP H0345908 B2 JPH0345908 B2 JP H0345908B2 JP 4294584 A JP4294584 A JP 4294584A JP 4294584 A JP4294584 A JP 4294584A JP H0345908 B2 JPH0345908 B2 JP H0345908B2
- Authority
- JP
- Japan
- Prior art keywords
- resin film
- wiring board
- conductor circuit
- adhesive
- flexible wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4294584A JPS60189285A (ja) | 1984-03-08 | 1984-03-08 | フレキシブル配線板およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4294584A JPS60189285A (ja) | 1984-03-08 | 1984-03-08 | フレキシブル配線板およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60189285A JPS60189285A (ja) | 1985-09-26 |
| JPH0345908B2 true JPH0345908B2 (cs) | 1991-07-12 |
Family
ID=12650146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4294584A Granted JPS60189285A (ja) | 1984-03-08 | 1984-03-08 | フレキシブル配線板およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60189285A (cs) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0414949Y2 (cs) * | 1984-12-29 | 1992-04-03 |
-
1984
- 1984-03-08 JP JP4294584A patent/JPS60189285A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60189285A (ja) | 1985-09-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5369881A (en) | Method of forming circuit wiring pattern | |
| US4209355A (en) | Manufacture of bumped composite tape for automatic gang bonding of semiconductor devices | |
| TW456162B (en) | Rigid/flex printed circuit board and manufacturing method therefor | |
| US4964947A (en) | Method of manufacturing double-sided wiring substrate | |
| EP0147566B1 (en) | Method of forming contacts for flexible module carriers | |
| JP3310037B2 (ja) | プリント配線板の製造方法 | |
| JP3427011B2 (ja) | 可撓性多層回路基板の製造法 | |
| JPH04127492A (ja) | プリント配線用材とその製造方法とプリント配線板 | |
| JPH0345908B2 (cs) | ||
| US6750148B2 (en) | Method of manufacturing wireless suspension blank | |
| JPH0239594A (ja) | リジッドフレキシブル配線板の製造方法 | |
| JPS60216573A (ja) | フレキシブル印刷配線板の製造方法 | |
| JP2717200B2 (ja) | 電子部品搭載用基板におけるオーバーレイめっきの形成方法 | |
| JPH05275852A (ja) | 金属芯入りプリント配線板及びその製造方法 | |
| JPH10116861A (ja) | キャリアテープ、及びキャリアテープ製造方法 | |
| JP3712105B2 (ja) | フレキシブルビルドアップ多層プリント配線板の製造方法 | |
| JP3225451B2 (ja) | 積層プリント基板の製造方法 | |
| JP2829345B2 (ja) | 薄膜基板の製造方法 | |
| JPS648478B2 (cs) | ||
| JPH0378794B2 (cs) | ||
| JPH0336319B2 (cs) | ||
| JPS6355236B2 (cs) | ||
| JPH04150090A (ja) | キャリアテープ付可撓性回路基板及びその製造法 | |
| JPH0352236B2 (cs) | ||
| JPH0426185A (ja) | フレキシブル部分を有するプリント配線板及びその製造方法 |