JPH0343780B2 - - Google Patents

Info

Publication number
JPH0343780B2
JPH0343780B2 JP58049824A JP4982483A JPH0343780B2 JP H0343780 B2 JPH0343780 B2 JP H0343780B2 JP 58049824 A JP58049824 A JP 58049824A JP 4982483 A JP4982483 A JP 4982483A JP H0343780 B2 JPH0343780 B2 JP H0343780B2
Authority
JP
Japan
Prior art keywords
insulating film
film
resist
wiring
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58049824A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59175735A (ja
Inventor
Osamu Akanuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58049824A priority Critical patent/JPS59175735A/ja
Publication of JPS59175735A publication Critical patent/JPS59175735A/ja
Publication of JPH0343780B2 publication Critical patent/JPH0343780B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/093
    • H10W70/60
    • H10W90/00

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
JP58049824A 1983-03-25 1983-03-25 電子回路装置の製造方法 Granted JPS59175735A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58049824A JPS59175735A (ja) 1983-03-25 1983-03-25 電子回路装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58049824A JPS59175735A (ja) 1983-03-25 1983-03-25 電子回路装置の製造方法

Publications (2)

Publication Number Publication Date
JPS59175735A JPS59175735A (ja) 1984-10-04
JPH0343780B2 true JPH0343780B2 (index.php) 1991-07-03

Family

ID=12841843

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58049824A Granted JPS59175735A (ja) 1983-03-25 1983-03-25 電子回路装置の製造方法

Country Status (1)

Country Link
JP (1) JPS59175735A (index.php)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10321562B2 (en) * 2016-07-22 2019-06-11 Lg Innotek Co., Ltd Flexible circuit board, COF module and electronic device comprising the same

Also Published As

Publication number Publication date
JPS59175735A (ja) 1984-10-04

Similar Documents

Publication Publication Date Title
US5226232A (en) Method for forming a conductive pattern on an integrated circuit
US3680206A (en) Assemblies of semiconductor devices having mounting pillars as circuit connections
JPS5815250A (ja) 半導体装置の製造方法
JPH053159B2 (index.php)
JPH06252151A (ja) 半導体チップバンプの製造方法
JPH02251145A (ja) 突起電極形成方法
JPH0343780B2 (index.php)
JP3573894B2 (ja) 半導体装置及びその製造方法
JPH05283412A (ja) 半導体装置,およびその製造方法
JP2751242B2 (ja) 半導体装置の製造方法
JPS6125221B2 (index.php)
JPS62160744A (ja) 半導体素子の製造方法
JPS63119551A (ja) パタ−ニングされた金属膜の形成方法
JP2985426B2 (ja) 半導体装置およびその製造方法
JPH0485829A (ja) 半導体装置及びその製造方法
JPH02277242A (ja) 半導体装置の製造方法
JP3036086B2 (ja) 半導体装置の製造方法
JPS5833853A (ja) 半導体装置の製造方法
JPH0497532A (ja) 半導体装置の製造方法
JP2795475B2 (ja) プリント配線板及びその製造方法
GB2244176A (en) Method and apparatus for forming a conductive pattern on an integrated circuit
KR0173178B1 (ko) 반도체 금속막 식각공정
JPS5874037A (ja) 半導体装置の製造方法
JPH02198141A (ja) 半導体装置のバンプ電極の製造方法
JP2534496B2 (ja) 半導体装置の製造方法