JPH0342508B2 - - Google Patents

Info

Publication number
JPH0342508B2
JPH0342508B2 JP58028027A JP2802783A JPH0342508B2 JP H0342508 B2 JPH0342508 B2 JP H0342508B2 JP 58028027 A JP58028027 A JP 58028027A JP 2802783 A JP2802783 A JP 2802783A JP H0342508 B2 JPH0342508 B2 JP H0342508B2
Authority
JP
Japan
Prior art keywords
cutting
degrees
compound semiconductor
wafer
chipping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58028027A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59152638A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP58028027A priority Critical patent/JPS59152638A/ja
Publication of JPS59152638A publication Critical patent/JPS59152638A/ja
Publication of JPH0342508B2 publication Critical patent/JPH0342508B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
JP58028027A 1983-02-21 1983-02-21 化合物半導体の切断方法 Granted JPS59152638A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58028027A JPS59152638A (ja) 1983-02-21 1983-02-21 化合物半導体の切断方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58028027A JPS59152638A (ja) 1983-02-21 1983-02-21 化合物半導体の切断方法

Publications (2)

Publication Number Publication Date
JPS59152638A JPS59152638A (ja) 1984-08-31
JPH0342508B2 true JPH0342508B2 (enrdf_load_stackoverflow) 1991-06-27

Family

ID=12237256

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58028027A Granted JPS59152638A (ja) 1983-02-21 1983-02-21 化合物半導体の切断方法

Country Status (1)

Country Link
JP (1) JPS59152638A (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62105446A (ja) * 1985-10-31 1987-05-15 Sharp Corp 半導体装置の製造方法
JPH0256987A (ja) * 1988-02-23 1990-02-26 Mitsubishi Electric Corp 混成集積回路の実装方法
JP2002090566A (ja) 2000-09-20 2002-03-27 Furukawa Electric Co Ltd:The 光導波回路装置
JP2005033196A (ja) * 2003-06-19 2005-02-03 Showa Denko Kk 半導体ウエーハのダイシング方法および発光ダイオードチップ
US7183137B2 (en) * 2003-12-01 2007-02-27 Taiwan Semiconductor Manufacturing Company Method for dicing semiconductor wafers
JP2008028139A (ja) * 2006-07-21 2008-02-07 Ricoh Co Ltd 半導体チップの製造方法、面発光型半導体レーザ、面発光型半導体レーザアレイ、光走査装置及び画像形成装置
JP2008235521A (ja) * 2007-03-20 2008-10-02 Sanyo Electric Co Ltd 半導体基板の割断方法及び太陽電池の割断方法並びに太陽電池
JP6433644B2 (ja) * 2013-06-07 2018-12-05 シーメンス アクチエンゲゼルシヤフトＳｉｅｍｅｎｓ Ａｋｔｉｅｎｇｅｓｅｌｌｓｃｈａｆｔ 半導体ウェハのダイシング方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS526144B2 (enrdf_load_stackoverflow) * 1972-08-24 1977-02-19

Also Published As

Publication number Publication date
JPS59152638A (ja) 1984-08-31

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