JPH0341999B2 - - Google Patents
Info
- Publication number
- JPH0341999B2 JPH0341999B2 JP61068188A JP6818886A JPH0341999B2 JP H0341999 B2 JPH0341999 B2 JP H0341999B2 JP 61068188 A JP61068188 A JP 61068188A JP 6818886 A JP6818886 A JP 6818886A JP H0341999 B2 JPH0341999 B2 JP H0341999B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- wiring board
- contact
- intermediate layer
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010410 layer Substances 0.000 claims description 48
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 30
- 238000007747 plating Methods 0.000 claims description 27
- 239000004020 conductor Substances 0.000 claims description 25
- 239000002344 surface layer Substances 0.000 claims description 17
- 239000010931 gold Substances 0.000 claims description 16
- 229910052737 gold Inorganic materials 0.000 claims description 16
- 229910052759 nickel Inorganic materials 0.000 claims description 15
- 239000012790 adhesive layer Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 230000005012 migration Effects 0.000 description 8
- 238000013508 migration Methods 0.000 description 8
- 238000007789 sealing Methods 0.000 description 8
- 238000005530 etching Methods 0.000 description 5
- 239000003292 glue Substances 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- 230000007261 regionalization Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000002788 crimping Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61068188A JPS61216394A (ja) | 1986-03-26 | 1986-03-26 | Ｉｃカード用多層プリント配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61068188A JPS61216394A (ja) | 1986-03-26 | 1986-03-26 | Ｉｃカード用多層プリント配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61216394A JPS61216394A (ja) | 1986-09-26 |
| JPH0341999B2 true JPH0341999B2 (zh) | 1991-06-25 |
Family
ID=13366556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61068188A Granted JPS61216394A (ja) | 1986-03-26 | 1986-03-26 | Ｉｃカード用多層プリント配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61216394A (zh) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5231672A (en) * | 1975-09-05 | 1977-03-10 | Hitachi Ltd | Ceramic package |
| JPS5376367A (en) * | 1976-12-20 | 1978-07-06 | Hitachi Ltd | Method of producing printed board |
| JPS5718799A (en) * | 1980-07-10 | 1982-01-30 | Johoku Kagaku Kogyo Kk | Lubricant composition |
| JPS6018578B2 (ja) * | 1979-05-10 | 1985-05-11 | アルフレツド・テヴエス・ゲ−エムベ−ハ− | 自動車用バキユ−ムブレ−キブ−スタ |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57159269U (zh) * | 1981-03-31 | 1982-10-06 | ||
| JPS59112970U (ja) * | 1983-01-21 | 1984-07-30 | 旭光学工業株式会社 | 多層構造回路 |
| JPS6018578U (ja) * | 1983-07-15 | 1985-02-07 | 株式会社日立製作所 | 湿式多層セラミツク基板 |
-
1986
- 1986-03-26 JP JP61068188A patent/JPS61216394A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5231672A (en) * | 1975-09-05 | 1977-03-10 | Hitachi Ltd | Ceramic package |
| JPS5376367A (en) * | 1976-12-20 | 1978-07-06 | Hitachi Ltd | Method of producing printed board |
| JPS6018578B2 (ja) * | 1979-05-10 | 1985-05-11 | アルフレツド・テヴエス・ゲ−エムベ−ハ− | 自動車用バキユ−ムブレ−キブ−スタ |
| JPS5718799A (en) * | 1980-07-10 | 1982-01-30 | Johoku Kagaku Kogyo Kk | Lubricant composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61216394A (ja) | 1986-09-26 |
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