JPH0341952B2 - - Google Patents
Info
- Publication number
- JPH0341952B2 JPH0341952B2 JP20819584A JP20819584A JPH0341952B2 JP H0341952 B2 JPH0341952 B2 JP H0341952B2 JP 20819584 A JP20819584 A JP 20819584A JP 20819584 A JP20819584 A JP 20819584A JP H0341952 B2 JPH0341952 B2 JP H0341952B2
- Authority
- JP
- Japan
- Prior art keywords
- gas
- heating
- soldering
- temperature distribution
- locally
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010438 heat treatment Methods 0.000 claims description 48
- 238000000034 method Methods 0.000 claims description 15
- 238000005476 soldering Methods 0.000 claims description 13
- 238000007664 blowing Methods 0.000 claims description 2
- 238000009423 ventilation Methods 0.000 claims 3
- 230000020169 heat generation Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 19
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000010453 quartz Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 230000007547 defect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000005611 electricity Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Landscapes
- Control Of Resistance Heating (AREA)
- Furnace Details (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20819584A JPS6188480A (ja) | 1984-10-05 | 1984-10-05 | 局所加熱方法及び装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20819584A JPS6188480A (ja) | 1984-10-05 | 1984-10-05 | 局所加熱方法及び装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6188480A JPS6188480A (ja) | 1986-05-06 |
JPH0341952B2 true JPH0341952B2 (enrdf_load_stackoverflow) | 1991-06-25 |
Family
ID=16552230
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20819584A Granted JPS6188480A (ja) | 1984-10-05 | 1984-10-05 | 局所加熱方法及び装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6188480A (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012146842A (ja) * | 2011-01-13 | 2012-08-02 | Sensbey Co Ltd | 選択はんだ付け装置および選択はんだ付け方法 |
JP6017526B2 (ja) | 2014-12-17 | 2016-11-02 | シナノケンシ株式会社 | 回転体駆動装置 |
-
1984
- 1984-10-05 JP JP20819584A patent/JPS6188480A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6188480A (ja) | 1986-05-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100314974B1 (ko) | 부품 탈부착 방법 및 그 장치 | |
US6068175A (en) | System for replacing a first area array component connected to an interconnect board | |
US6911624B2 (en) | Component installation, removal, and replacement apparatus and method | |
JPH0332098A (ja) | レーザーリフロー半田付け方法及びこれによる配線組立て体 | |
JP2001015545A (ja) | ワイヤボンディング装置及び方法 | |
JPH0760933B2 (ja) | 電子デバイスの表面実装方法 | |
US5648005A (en) | Modified quartz plate to provide non-uniform light source | |
JPH0479135B2 (enrdf_load_stackoverflow) | ||
US4909428A (en) | Furnace to solder integrated circuit chips | |
CN209435565U (zh) | 一种bga拆焊加热装置 | |
JPH0341952B2 (enrdf_load_stackoverflow) | ||
JPH08330686A (ja) | プリント基板 | |
JP2682507B2 (ja) | 自動半田付け用プリヒータ装置 | |
JPH0241771A (ja) | 半田付装置 | |
JPS63318133A (ja) | 電子回路素子の取外し装置 | |
JP2735059B2 (ja) | プリント配線板の実装部品のリペア方法 | |
JPS61253164A (ja) | 局所加熱方法 | |
JP2000221234A (ja) | バーンイン装置及びバーンイン方法 | |
JPH0749155B2 (ja) | 温風による半田溶解装置 | |
JPH11121531A (ja) | 電子部品の実装方法および実装装置 | |
JPH07263494A (ja) | 溶融可能な材料により接続を行うための加熱装置 | |
JPH1032384A (ja) | 放熱フィン付き表面実装部品の取外し方法及びその装置 | |
JPH03114287A (ja) | チップ部品の実装方法 | |
JPH08298304A (ja) | 温度制御可能なチップ搭載用ブロック | |
JPH02276258A (ja) | ワイヤボンディング装置 |