JPH0341463Y2 - - Google Patents

Info

Publication number
JPH0341463Y2
JPH0341463Y2 JP1983083065U JP8306583U JPH0341463Y2 JP H0341463 Y2 JPH0341463 Y2 JP H0341463Y2 JP 1983083065 U JP1983083065 U JP 1983083065U JP 8306583 U JP8306583 U JP 8306583U JP H0341463 Y2 JPH0341463 Y2 JP H0341463Y2
Authority
JP
Japan
Prior art keywords
nozzle
resin
tip
tetrafluoroethylene
tube
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983083065U
Other languages
English (en)
Japanese (ja)
Other versions
JPS59184952U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8306583U priority Critical patent/JPS59184952U/ja
Publication of JPS59184952U publication Critical patent/JPS59184952U/ja
Application granted granted Critical
Publication of JPH0341463Y2 publication Critical patent/JPH0341463Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Nozzles (AREA)
  • Coating Apparatus (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP8306583U 1983-05-30 1983-05-30 半導体チップの樹脂モールド用ノズル Granted JPS59184952U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8306583U JPS59184952U (ja) 1983-05-30 1983-05-30 半導体チップの樹脂モールド用ノズル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8306583U JPS59184952U (ja) 1983-05-30 1983-05-30 半導体チップの樹脂モールド用ノズル

Publications (2)

Publication Number Publication Date
JPS59184952U JPS59184952U (ja) 1984-12-08
JPH0341463Y2 true JPH0341463Y2 (enrdf_load_stackoverflow) 1991-08-30

Family

ID=30213024

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8306583U Granted JPS59184952U (ja) 1983-05-30 1983-05-30 半導体チップの樹脂モールド用ノズル

Country Status (1)

Country Link
JP (1) JPS59184952U (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0632205Y2 (ja) * 1989-03-08 1994-08-24 エーザイ株式会社 高粘度剤コーティング用のノズルチップ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52151325A (en) * 1976-06-11 1977-12-15 Denki Kagaku Kogyo Kk Process and apparatus for coating adhesives
JPS5925495Y2 (ja) * 1977-09-17 1984-07-26 昭和電工株式会社 薬剤の噴霧用ノズル

Also Published As

Publication number Publication date
JPS59184952U (ja) 1984-12-08

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