JPS59184952U - 半導体チップの樹脂モールド用ノズル - Google Patents

半導体チップの樹脂モールド用ノズル

Info

Publication number
JPS59184952U
JPS59184952U JP8306583U JP8306583U JPS59184952U JP S59184952 U JPS59184952 U JP S59184952U JP 8306583 U JP8306583 U JP 8306583U JP 8306583 U JP8306583 U JP 8306583U JP S59184952 U JPS59184952 U JP S59184952U
Authority
JP
Japan
Prior art keywords
nozzle
semiconductor chips
resin molding
tetrafluoroethylene
discharging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8306583U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0341463Y2 (enrdf_load_stackoverflow
Inventor
正夫 山崎
小島　久彰
西崎　雅士
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP8306583U priority Critical patent/JPS59184952U/ja
Publication of JPS59184952U publication Critical patent/JPS59184952U/ja
Application granted granted Critical
Publication of JPH0341463Y2 publication Critical patent/JPH0341463Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Nozzles (AREA)
  • Coating Apparatus (AREA)
JP8306583U 1983-05-30 1983-05-30 半導体チップの樹脂モールド用ノズル Granted JPS59184952U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8306583U JPS59184952U (ja) 1983-05-30 1983-05-30 半導体チップの樹脂モールド用ノズル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8306583U JPS59184952U (ja) 1983-05-30 1983-05-30 半導体チップの樹脂モールド用ノズル

Publications (2)

Publication Number Publication Date
JPS59184952U true JPS59184952U (ja) 1984-12-08
JPH0341463Y2 JPH0341463Y2 (enrdf_load_stackoverflow) 1991-08-30

Family

ID=30213024

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8306583U Granted JPS59184952U (ja) 1983-05-30 1983-05-30 半導体チップの樹脂モールド用ノズル

Country Status (1)

Country Link
JP (1) JPS59184952U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02117047U (enrdf_load_stackoverflow) * 1989-03-08 1990-09-19

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52151325A (en) * 1976-06-11 1977-12-15 Denki Kagaku Kogyo Kk Process and apparatus for coating adhesives
JPS5450808U (enrdf_load_stackoverflow) * 1977-09-17 1979-04-09

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52151325A (en) * 1976-06-11 1977-12-15 Denki Kagaku Kogyo Kk Process and apparatus for coating adhesives
JPS5450808U (enrdf_load_stackoverflow) * 1977-09-17 1979-04-09

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02117047U (enrdf_load_stackoverflow) * 1989-03-08 1990-09-19

Also Published As

Publication number Publication date
JPH0341463Y2 (enrdf_load_stackoverflow) 1991-08-30

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