JPH0340953B2 - - Google Patents

Info

Publication number
JPH0340953B2
JPH0340953B2 JP58137152A JP13715283A JPH0340953B2 JP H0340953 B2 JPH0340953 B2 JP H0340953B2 JP 58137152 A JP58137152 A JP 58137152A JP 13715283 A JP13715283 A JP 13715283A JP H0340953 B2 JPH0340953 B2 JP H0340953B2
Authority
JP
Japan
Prior art keywords
ring
flat hollow
plates
plate
hollow body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58137152A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6028254A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP58137152A priority Critical patent/JPS6028254A/ja
Publication of JPS6028254A publication Critical patent/JPS6028254A/ja
Publication of JPH0340953B2 publication Critical patent/JPH0340953B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58137152A 1983-07-27 1983-07-27 半導体素子冷却装置 Granted JPS6028254A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58137152A JPS6028254A (ja) 1983-07-27 1983-07-27 半導体素子冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58137152A JPS6028254A (ja) 1983-07-27 1983-07-27 半導体素子冷却装置

Publications (2)

Publication Number Publication Date
JPS6028254A JPS6028254A (ja) 1985-02-13
JPH0340953B2 true JPH0340953B2 (OSRAM) 1991-06-20

Family

ID=15192031

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58137152A Granted JPS6028254A (ja) 1983-07-27 1983-07-27 半導体素子冷却装置

Country Status (1)

Country Link
JP (1) JPS6028254A (OSRAM)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61141867A (ja) * 1984-12-14 1986-06-28 Tsuboya Seizaburo すじこ及びいくらの製造法
US5229915A (en) * 1990-02-07 1993-07-20 Ngk Insulators, Ltd. Power semiconductor device with heat dissipating property
US20200128954A1 (en) * 2017-06-05 2020-04-30 Hidetoshi Nishio Cabinet

Also Published As

Publication number Publication date
JPS6028254A (ja) 1985-02-13

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