JPH0340953B2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field The present invention relates to a cooling device for semiconductor devices such as thyristors, diodes, and transistors.More specifically, the present invention relates to a cooling device for semiconductor devices such as thyristors, diodes, and transistors. The present invention relates to a cooling device that includes a tank section and a heat dissipation section, immerses a semiconductor device in a refrigerant, and cools the semiconductor device using boiling and condensation of the refrigerant.

BACKGROUND ART AND PROBLEMS TO BE SOLVED BY THE INVENTION Conventionally, in this type of semiconductor device cooling device, a tank for sealing a refrigerant and a radiator equipped with a refrigerant flow pipe and radiating fins are assembled separately, and these are assembled together. There is one in which the refrigerant flow pipe is placed so that it communicates with the inside of the tank and assembled by welding or the like. However, the conventional semiconductor device cooling device has a problem in that the tank and the heat exchanger are assembled separately, which increases the number of man-hours, which is time-consuming and expensive. Another problem was that this semiconductor device cooling device required a large space.

This invention was made in view of the above circumstances, and an object of the present invention is to provide a semiconductor device cooling device that is easy to assemble, is inexpensive, can be made compact, and has excellent cooling efficiency. do.

Means for Solving the Problems A semiconductor device cooling device according to the present invention includes a pair of vertically elongated plates each having a hole at the bottom thereof, which are arranged opposite to each other, and at least both side edges and the entire periphery of both plates. A plurality of vertically elongated flat hollow bodies whose lower edges are joined via a connecting wall located between both plates are arranged in parallel, and all the flat hollow bodies are connected to each other through a connecting wall located between both plates. They are connected in communication with each other by a ring interposed at the bottom so as to surround the hole, a heat dissipation fin is interposed between adjacent flat hollow bodies above the ring, and a plate fin is fitted onto the ring. The portion of each flat hollow body above the ring and the heat radiation fin form a heat radiation part, and the ring and the part of the flat hollow body located at a height corresponding to the ring form a tank part. A liquid refrigerant is stored in a tank portion, and a semiconductor element is immersed in the liquid refrigerant.

In the above, joining at least both side edges and the lower edge of the entire circumferential edges of a pair of plates arranged opposite to each other via a connecting wall portion located between the plates is performed by a solder size. The connecting wall portion may be separate from the plate, or may be provided integrally with the plate, for example by bending the plate. It is preferable that corrugated fins having a plurality of concave and convex lines extending in the vertical direction are arranged inside the flat hollow body and brazed to the inner surface. The flat hollow body and the ring are joined by brazing, for example. Preferably, both ends of the ring are provided with protrusions that can fit into holes drilled in the lower part of the plate. It is preferable to braze the flat hollow body and the heat radiation fin. It is preferable that the plate fin is provided with a protrusion or a raised cut, and is brought into contact with another adjacent plate fin and the flat hollow body. By doing so, the plate fin can be held in a predetermined position when joining the plate fin to the ring, and the joining can be easily and reliably performed. Further, it is preferable that the plate fins be joined to the ring by brazing. Brazing between the peripheral edges of the plates, brazing between the flat hollow body and the ring, brazing between the flat hollow body and the radiation fins, and brazing between the plate fins and the ring are performed simultaneously, for example, by vacuum brazing dimensions.

Function: In this semiconductor device cooling device, a liquid refrigerant sealing tank portion is formed by the ring and a portion of each flat hollow body located at a height position corresponding to the ring.
A heat radiation part is formed by the portion above the ring in each flat hollow body and the heat radiation fin, and the semiconductor element is immersed in the liquid refrigerant stored in the tank part, so that the heat emitted from the semiconductor element is absorbed. When transmitted to the liquid refrigerant, the liquid refrigerant boils and vaporizes, producing gaseous refrigerant. A portion of the heat contained in the gaseous refrigerant is first radiated from the plate fins joined to the outside of the ring. Furthermore, the gaseous refrigerant rises within the flat hollow body and reaches the heat radiation section, and the heat of the gaseous refrigerant is radiated from the plates and the heat radiation fins to the air between the flat hollow bodies, and the refrigerant is condensed. The condensed liquid refrigerant flows down the flat hollow body and returns to the tank section. This operation is repeated to cool the semiconductor element.

Embodiments The present invention will be described in detail below with reference to embodiments shown in the drawings. In the following description, left and right refer to those toward FIG. 1.

The semiconductor device cooling device 1 is formed from a pair of vertically rectangular aluminum brazing sheet plates 2 arranged oppositely, and includes a plurality of flat hollow bodies 3 arranged in parallel, and a plurality of flat hollow bodies 3 arranged in parallel. an aluminum circular ring 4 disposed between the lower parts and connecting the flat hollow bodies 3 in a continuous manner;
, a heat dissipation fin 5 made of an aluminum corrugated fin interposed between the adjacent flat hollow bodies 3 above the ring 4, and a plurality of plate fins 6 made of an aluminum brazing sheet fitted over the ring 4 and brazed to the ring 4. It is equipped with

There is a circular hole 2 at the bottom of the aluminum plate 2.
A is open. The flat hollow body 3 is formed by brazing both side edges and lower edges of the entire peripheral edges of a pair of opposing plates 2 through an aluminum connecting wall 7 (connecting wall portion) formed separately from the plates 2. It is formed by Flat hollow body 3
Inside, an aluminum corrugated fin 8 having a large number of uneven lines extending in the vertical direction is arranged and brazed to the inner surface of the plate 2. Also,
At a position below the corrugated fin 8 in the flat hollow body 3 and around the hole 2a,
Aluminum corrugated fins 9 are arranged at four locations at predetermined intervals in the circumferential direction, and the plate 2
It is brazed on the inner surface of. This fin 9 also plays a role of heat radiation. Flat hollow body 3 located at both left and right ends
Side plates 1 made of aluminum brazing sheets each having a vertical rectangular shape and having circular holes 10a drilled at the bottom at predetermined intervals are disposed on the left and right sides of the
0 is arranged and brazed to the flat hollow body 3 via an aluminum circular ring 11. Heat dissipation fins 12 made of aluminum corrugated fins having many uneven streaks extending in the width direction are also disposed above the ring 11 between the side plate 10 and the flat hollow bodies 3 at both left and right ends. Hollow body 3 and side plate 10
It is soldered to. In addition, the ring 11 also includes a plurality of plates 1 made of aluminum brazing sheets.
3 is fitted over and brazed. The upper ends of all the flat hollow bodies 3 are connected to an aluminum air reservoir 14 whose bottom surface is open.
4 is connected to communicate with the inside. The width of the air reservoir 14 is equal to the width of the flat hollow body 3. The upper end of the side plate 10 is also joined to both left and right ends of the air reservoir 14. The remaining portion of the lower opening of the air reservoir 14 is formed by aluminum square members 15 interposed between the upper ends of adjacent flat hollow bodies 3 and between the upper ends of the flat hollow bodies 3 at both left and right ends and the upper ends of the side plates 10. It is blocked. A pipe 16 is attached to the left end of the air reservoir 14 for evacuating the inside of the semiconductor device cooling device 1 and for introducing a refrigerant into the inside of the device 1. This tube 16 is
After charging the refrigerant, it is closed as shown in FIG.

A protrusion 4a that can fit into the hole 2a of the plate 2 is provided at both ends of the ring 4.
It is brazed to the plate 2 with the hole 2a fitted into the hole 2a. Further, projections 11a are provided at both ends of the ring 11, and one projection 11a is fitted into the hole 2a of the plate 2, and the other projection 11a is fitted into the hole 2a of the plate 2.
The ring 11 is brazed to the plate 2 and the side plate 10 with the ring 11 being fitted into the hole 10a of the side plate 10. Aluminum pipes 17 and 18 are welded to the holes 10a of the left and right side plates 10 so as to communicate with each other, respectively.
A protrusion that can fit into the hole 10a is provided at the joint end of both pipes 17 and 18 to the side plate 10,
This protrusion is fitted into the hole 10a and welded. A flange 17a is attached to the left end of the left pipe 17.
is provided, and a lid 19 is attached to this flange 17a. A flange 18a is provided at the right end of the right pipe 18, and a lid 20 is attached to this flange 18a. The lid 20 has a hole 20a through which a power supply line 25 for supplying power to the semiconductor element 23 immersed in the liquid refrigerant C in the tank part B is inserted, as will be described later.

The heat dissipation fin 5 has a large number of uneven streaks extending in the width direction of the flat hollow body 3.
It is soldered to.

The plate fin 6 is approximately square, and has a ring insertion hole 6a having a diameter equal to the outer diameter of the ring 4. Furthermore, projections 21 are formed at each of the four corners of the plate fin 6. four protrusions 21
Two of them located on one diagonal line protrude in the opposite direction to the two things located on the other diagonal line. The tip of the protrusion 21 is in contact with another adjacent plate fin 6 and the flat hollow body 3. Similarly to the plate fin 6, the plate fin 13 is also provided with a ring insertion hole 13a and four protrusions 22.

This semiconductor device cooling device 1 includes each flat hollow body 3.
A heat dissipation part A is formed by the portion above the ring 4 and the heat dissipation fin 5.
1. A portion of the flat hollow body 3 existing at a height position corresponding to the rings 4, 11 and the pipe 17,
Tank part B is formed by 18, and both parts A and B are integrated. A liquid refrigerant C made of fluorocarbon is sealed in the semiconductor device cooling device 1, and this liquid refrigerant C is accumulated in the tank portion B. The air, etc. that gets caught in the liquid refrigerant C is
Since it is lighter than Freon, it is pushed up into the air reservoir 14.

Inside the tank portion B, semiconductor elements 23 and cooling fins 24 are arranged in layers alternately in the left-right direction and supported by appropriate means (not shown). Power is supplied to the semiconductor element 23 through a power supply line 25. The power supply line 25 is led out through the hole 20a, and
An insulating material 26 is filled around the power supply line 25 in 0a. The cooling fins 24 are made of copper or aluminum alloy, and aluminum powder 27 is brazed to cover the entire surface of the cooling fins 24, except for the semiconductor element mounting portions on both left and right sides, thereby forming a porous surface. The aluminum powder 27 is made by dissolving the aluminum powder 27 and aluminum brazing filler metal powder in an organic binder such as acrylic to form a slurry, which is applied to the cooling fins 24.
Brazed after drying. If the cooling fins 24 are made of copper, the surfaces of the fins 24 are plated with nickel in advance, since they cannot be made porous because they cause a eutectic reaction with the aluminum powder and diffuse into each other.

In such a configuration, heat generated from the semiconductor element 23 is transmitted to the liquid coolant C via the cooling fins 24 and the aluminum powder 27. At this time,
Aluminum powder 2 on the surface of the cooling fin 24
The porous voids formed in step 7 become boiling nuclei of vapor bubbles, and the liquid refrigerant C is easily boiled by the heat. The heat possessed by the gaseous refrigerant thus generated is first transferred from the plate fins 6, 13 to the air flowing around the rings 4, 11 between the flat hollow bodies 3 and between the flat hollow bodies 3 and the side plate 10. Heat is dissipated. Furthermore, the gaseous refrigerant rises inside the flat hollow body 3 and reaches the heat radiation part A.
The heat possessed by the gaseous refrigerant is radiated to the air flowing between the flat hollow bodies 3 via the plate 2 and the radiation fins 5, and the gaseous refrigerant is condensed. The condensed liquid refrigerant flows through the air and returns to tank section B. The semiconductor element 23 is cooled by repeating such operations.

The semiconductor device cooling device 1 is assembled, for example, as follows.

First, plate 2, corrugated fins 8, 9,
The connecting wall 7, heat dissipation fins 5, rings 4, 11, plate fins 6 and side plates 10 are set in predetermined positions and brazed together by vacuum brazing. After that, the air reservoir 14 and the pipe 17,
Weld 18.

In the above embodiment, the hole 2a drilled in the plate 2 and the ring 4 are circular, but the shape is not limited to this. Further, in the above embodiment, only the opposite side edges and the lower edges of the pair of plates 2 arranged opposite to each other are connected to each other via the connecting wall 7, but the upper edges are also connected to each other via the connecting wall. In this case, a part of the connecting wall interposed between the upper edges of the plates is cut out to communicate the inside of the flat hollow body 3 and the working reservoir 14. Furthermore, although the air reservoir 14 is provided in the above embodiment, this is not necessarily required. In this case, the entire peripheries of a pair of plates 2 arranged opposite to each other are joined together via a connecting wall, and the space between the plates 2 is sealed.

Effects of the Invention Since the semiconductor device cooling device of the present invention is configured as described above, it is possible to simultaneously join the plates, the plates and the connecting wall, the plates and the heat dissipation fins, and the plates and the ring. , it is possible to obtain a semiconductor device cooling device in which the refrigerant sealed tank portion and the heat radiation portion are integrated.
Therefore, there is no need to separately assemble a refrigerant sealed tank and a radiator and connect them with a refrigerant flow pipe as in conventional semiconductor device cooling devices, so assembly is easy and inexpensive. Moreover, it can be made compact. moreover,
Since the plate fins are fitted over the ring and joined to the ring, the cooling air flows uniformly in all parts between adjacent flat hollow bodies, and the heat possessed by the gaseous refrigerant is also radiated from the plate fins.
Therefore, cooling efficiency is further improved.

[Brief explanation of drawings]

The drawings show an embodiment of the invention, in which FIG. 1 is a partially cutaway front view, FIG. 2 is a sectional view taken along the - line in FIG. 1, and FIG. 3 is a sectional view taken along the - line in FIG. 1. , FIG. 4 is a sectional view taken along the - line in FIG. 1, FIG. 5 is a vertical sectional view of the cooling fin, and FIG. 6 is a perspective view of the plate fin. 1... Semiconductor element cooling device, 2... Plate,
2a...hole, 3...flat hollow body, 4...ring,
5... Heat dissipation fin, 6... Plate fin, 7...
...Connection wall (connection wall part), 23...Semiconductor element, A
...heat dissipation section, B...tank section, C...liquid refrigerant.

Claims (1)

[Claims] 1 A connection in which a pair of vertically elongated plates 2 with holes 2a drilled at the bottom are arranged facing each other, and at least both side edges and lower edges of the entire circumferential edges of both plates 2 are located between both plates 2. A vertically long flat hollow body 3 joined via a wall portion 7
are arranged in parallel, and all the flat hollow bodies 3 are connected to each other in a continuous manner by a ring 4 interposed at the lower part between adjacent flat hollow bodies 3 so as to surround the hole 2a. A heat dissipation fin 5 is interposed between adjacent flat hollow bodies 3 above the ring 4, and a plate fin 6 is fitted over the ring 4 and joined to the ring 4. A heat dissipation part A is formed by the upper part of the ring 4 and the heat dissipation fin 5, and a tank part B is formed by the ring 4 and a part of the flat hollow body 3 located at a height corresponding to the ring 4. A semiconductor device cooling device in which a liquid refrigerant C is stored and a semiconductor device 23 is immersed in the liquid refrigerant C.