JPS6028254A - Cooling device for semiconductor element - Google Patents

Abstract

PURPOSE:To obtain a compact cooling device, assembly thereof is simple, by arranging flat hollow bodies, lower end sections thereof have holes, in parallel, connecting the hollow bodies in a communicating manner through a ring and interposing fins among the hollow bodies in the upper sections of the ring. CONSTITUTION:Long size plates 2, lower ends thereof have holes 2a, fins 7, 8, connecting walls 6, radiator fins 5, rings 4, 10 surrounding the holes 2a, and side plates 9 are set at predetermined positions, and brazed under vacuum simultaneously. Air reservoirs 12 and pipes 15, 16 are welded together. A heat dissipation section A is formed integrally by sections upper than the rings 4 of flat hollow bodies 3 shaped in a communicating manner in parallel and the fins 5 and a tank B by the rings 4 and 10, sections corresponding to the rings of the hollow bodies 3 and the pipes 15, 16. Flon C is encapsulated into the tank B. The generated heat of an element 20 is transmitted over Flon C through fins 21 and Al powdered bodies 24, and boiling Flon is heat dissipated and returns to the tank B. According to the constitution, a device is assembled simply, the expense is also small, and the device can be made compact.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a cooling device for semiconductor devices such as thyristors, double diodes, and transistors. The present invention relates to a cooling device that has a tank part and a heat dissipation part, immerses a semiconductor element in a refrigerant, and cools the semiconductor element using boiling and condensation of the refrigerant.

Conventionally, in this type of semiconductor device cooling device, a tank in which the refrigerant is sealed and a radiator equipped with a refrigerant flow pipe A3 and heat radiation fins are assembled separately, and these are communicated with the inside of the tank by the refrigerant flow pipe. There are some that are assembled by welding, etc., with piping arranged in a straight line. However, the conventional semiconductor device cooling apparatus has the problem that the tank and the heat exchanger are assembled separately, which increases the number of man-hours, which is time-consuming and expensive. Furthermore, this semiconductor device cooling device also has the problem of requiring a large space.

This invention was made in view of the above circumstances, and an object of the present invention is to provide a semiconductor device cooling device that is easy to assemble, is inexpensive, can be made compact, and has excellent cooling efficiency. do.

In the semiconductor device cooling device according to the present invention, a pair of vertically long plates with holes at their lower ends are arranged facing each other, and a small portion of the entire circumferential edges of both plates (both side edges and lower edges are A plurality of vertically elongated flat hollow bodies connected through a connecting wall arranged between both plates or at a bent part provided on the plate are arranged in parallel, and each flat hollow body is connected to an adjacent flat hollow body. The hollow bodies are interconnected by a ring interposed at the lower end so as to surround the hole, and above the rings, a radiation fin is interposed between adjacent flat hollow bodies. A plate fin is fitted onto a ring and joined to the ring.

In the above, at least both side edges and the lower edge of the entire peripheral edges of a pair of plates arranged opposite to each other are joined through a connecting wall arranged between the plates, and a bending portion provided on the plates is used. The joining at the parts is done by the brazing method. Inside the flat hollow body, there is a corrugated structure with many uneven lines extending vertically.
It is preferable to arrange fins and braze (-1) on the inner surface. The flat hollow body and the ring are joined, for example, by brazing. It is preferable to provide a protrusion that can fit into the hole.It is preferable to braze the flat hollow body and the radiation fins.

Protrusions and cutouts are provided on the plate and fins,
It is preferable that the plate/fin be brought into contact with another adjacent plate/fin and the flat hollow body. In this way, when joining the plate/fin to the ring, the plate/fin can be held in place and the joining can be done easily and reliably. It is preferable to join the plates to each other by brazing.Brazing the peripheral edges of the plates, brazing the flat hollow body to the ring, brazing the flat hollow body to the fin, and brazing the plates/fins to the ring. Brazing is carried out simultaneously by, for example, the vacuum brazing (=I method).

In this semiconductor device cooling device, a liquid cooling I1. A sealing tank portion is formed, and a heat radiation portion is formed in each flat hollow body (a portion above the pull ring and a radiation fin).

Then, the semiconductor element is immersed in the liquid refrigerant sealed in the tank section. The heat emitted from the semiconductor element is transferred to the liquid refrigerant, but the refrigerant is i? I; II≧ and vaporize. A portion of the heat possessed by this scum-like refrigerant is first radiated from the plates and fins. Furthermore, the gaseous refrigerant rises within the flat hollow body and reaches the heat radiation part, and the heat of the gaseous refrigerant is radiated from the plates 1-a3 and the radiation fins to the air between the flat hollow bodies, and the refrigerant is condensed. The condensed liquid refrigerant flows down inside the flat hollow body and returns to the tank section. This operation is repeated to cool the semiconductor element.

The semiconductor device cooling device of the present invention is configured as described above, and the heat radiating portion such as the refrigerant sealed tank is integrated, so it is easier to assemble and less expensive than the conventional semiconductor device cooling device. It is possible to make it small and compact. Furthermore, since the plate and fins are fitted over the ring and joined to the ring, the cooling fluid flows uniformly between all adjacent flat hollow bodies, and the heat of the gaseous refrigerant is transferred from the plate and fins. Heat is also radiated.

Therefore, cooling efficiency is further improved.

The invention will be explained in detail below with reference to dimensional examples shown in the drawings. In the following description, left and right refer to those facing FIG. 1.

The semiconductor device cooling device (1) is formed from a pair of vertical rectangular aluminum brazing seams 1 to FM plates 1-(2> arranged in opposition to each other, and a plurality of flat hollow bodies (2) arranged in parallel. 3) and the adjacent flat hollow body (3)
An aluminum circular ring (4) is disposed between the lower ends of the hollow bodies (3) and connects the flat hollow bodies (3) in a continuous manner, and an aluminum circular ring (4) is interposed between the adjacent flat hollow bodies (3) above the rings (4) It is equipped with a radiation fin (5) made of a corrugated aluminum fin, and a plurality of play fins (6) made of an aluminum plating sheet that are fitted onto the ring (4) and brazed. .

The lower end of the aluminum plate (1-<2) has a circular hole (
2a) is open. The flat hollow body (3) is formed by brazing the entire rear side edges and lower edges of a pair of opposing plates (2) to each other via an aluminum connecting wall (7). Inside the flat hollow body (3), an aluminum corrugated fin (8) having a large number of irregularities extending vertically is arranged and brazed to the inner surface of the plate (2). At a position below the corrugated fins (8) in (3) and around the hole (2a), there are four aluminum corrugated fins (9) spaced at predetermined intervals J5 in the circumferential direction. The fins (9) also serve as heat dissipators.Fins (9) are placed on the left and right sides of the flat hollow body (3) located at both the left and right ends at a predetermined interval. A side plate (10) made of an aluminum plating sheet, which is vertically rectangular and has a circular hole (10a) in its lower end, is arranged, and a flat hollow body (
3) Niro (=J) side plate (10
radiating fins (12) made of aluminum corrugated fins having a large number of irregularities extending in the width direction also above the ring (11) between the flat hollow body (3) at both left and right ends. is placed in the flat hollow body (
3) and side play 1-(10).

Further, a plurality of aluminum plating sheet plates (13) are fitted over the ring (11) and brazed thereto. The upper ends of all the flat hollow bodies (3) are connected to an aluminum air reservoir (14) with an open bottom surface so that the inside of the flat hollow bodies (3) communicates with the inside of the air temperature (14). The width of the air reservoir (14) is that of the flat hollow body (3)
is equal to the width of The upper end of the side plate (10) is also joined to both left and right ends of the air reservoir (14). The remaining portion of the lower frontage of the air reservoir (14) is between the upper ends of adjacent flat hollow bodies (3) and between the upper ends of the flat hollow bodies (3) at both left and right ends and the upper ends of the side plates (10). It is closed by an interposed aluminum square (15).

At the left end of the air reservoir (14) is a semiconductor device cooling device (1).
A tube (16) is provided for evacuating the inside and for introducing a refrigerant into the inside of the device (1). This tube (
16) is closed off as shown in FIG. 1 after charging the refrigerant.

At both ends of the ring 4), there are holes (2a) in the plate (2).
A protrusion (4a) that can be fitted into the hole (2a) is installed, and when the protrusion (4a) is fitted into the hole (2a), the plate (
2) is brazed. Further, protrusions (11a) are provided at both ends of the ring (11), and one protrusion (l
la) is fitted into the hole (2a) of the plate (2), and the other protrusion (11a) is fitted into the hole (2a) of the side plate (10).
10a), the ring (11) is brazed to the plate (2) and the side play 1-(10). Holes (10) in left and right side plates (10)
In a), aluminum pipes (1
7) (18> is welded.

To side play I of both pipes (17) (18) (1
A protrusion that can be fitted into the hole (ioa) is provided at the joint end to the hole (10a), and this protrusion is fitted into the hole (10a) and welded. There is a flange (1) at the left end of the left pipe (17).
7a) is provided, and this flange <17a)! (19
) is removed (=l. A flange (18a) is provided at the right end of the right pipe (18), and this flange (
M (20) is attached (pulled) to 18a). Indigo (20)
) has a hole (20a) through which a power supply line (25) for supplying power to the semiconductor element (23) immersed in the liquid refrigerant (C) in the tank part (B) is inserted, as will be described later. It's open.

Heat dissipation fin (5) 4t, J5, flat hollow body (3) with many uneven sushi extending in the width direction of the flat hollow body (3).
3) It is said to be "niroi".

The plate/fin (6) is approximately square and has a ring insertion hole (6a) with a diameter equal to the outer diameter of the ring (4). A protrusion (21>) is formed on each of the four protrusions (21). Two of the four protrusions (21) located on one diagonal line protrude in the opposite direction to the other two protrusions located on the other diagonal line. The tip of the protrusion (21) is in contact with another adjacent plate fin (6) and the flat hollow body (3).The plate fin (13) also has the same structure as the plate fin (6>). ring insertion hole (13a-) and 4
Two protrusions (22) are provided.

This semiconductor element cooling device (1) includes each flat hollow body (3)
A heat dissipation part (A) is formed by the portion above the ring (4) and the heat dissipation fins (5), and the ring (4)
<11), ring (4) in flat hollow body (3) (
A tank part (B) is formed by the part existing at the height position corresponding to 11) and the pipes (17) and (18), and both parts (A>(B)) are integrated. A liquid refrigerant (C) made of fluorocarbon is sealed in the device (1), and this liquid refrigerant (C) is collected in the tank part (B). Since air is lighter than Freon, it is used as an air reservoir (14).
pushed inward.

Inside the tank part (B), semiconductor elements (23) and cooling fins (24) are arranged in layers alternately in the left and right direction, and are supported by suitable means (not shown).

Power is supplied to the semiconductor element (23) through a power supply line (25). The power supply line (25) is led out through the hole (20a), and an insulating material (26) is placed around the power supply line (25) in the hole (20a).
is filled. The cooling fins (24) are made of copper or aluminum alloy, and aluminum powder (27) is brazed to cover the entire surface of the cooling fins (27), except for the semiconductor element mounting portions on both left and right sides. has been done.

The aluminum powder (27) is prepared by, for example, dissolving the aluminum powder (27) and aluminum waxed powder in an organic binder such as acrylic, making a slurry, applying it to the cooling fins (24), and drying it. I was left deaf. If the cooling fins (24) are made of copper, the surface of the fins (24) should be plated with nickel in advance because it cannot be made into a porous surface that causes a eutectic reaction with the aluminum powder and diffuses between them.

In this configuration, heat generated from the semiconductor element (23) is transmitted to the liquid coolant (C) via the cooling fins (24) and the aluminum powder (27). At this time, the aluminum powder (27) on the surface of the cooling fin (24)
) The porous voids formed by the vapor bubbles become boiling nuclei, and the liquid refrigerant (C) is easily boiled by the heat. The heat possessed by the gaseous refrigerant thus generated is first transferred from the plate fins (6) (13) to a portion of the flat hollow body (3).
) and between the flat hollow body (3) and the side plate (10
) is radiated to the air flowing around the rings (4) and (11). Furthermore, the gaseous refrigerant rises inside the flat hollow body (3) and reaches the heat radiation part (A>.
), heat is radiated to the air flowing between the flat hollow bodies (3), and the gaseous refrigerant condenses. The condensed liquid refrigerant flows through the space and falls back to the tank section (B). The semiconductor element (23) is cooled by repeating such operations.

For example, the semiconductor device cooling device (1) is assembled as follows.

First, the plate (2), corrugated fins and side plate (10) are set in predetermined positions, and soldered simultaneously using the vacuum soldering method.

After that, the air reservoir (14) and the pipe (17) (18
) to weld.

In the above embodiment, the hole (2a) and the ring (4) formed in the play 1-(2> are circular, but the shape is not limited to this. Also, in the above embodiment, the hole (2a) and the ring (4) formed in the play 1-(2> Both side edges and lower edges of the pair of plates (2) placed in the plate (2) are connected to each other via the connecting wall (7), but the upper edges may also be connected to each other via the connecting wall. In this case, a part of the connecting wall interposed between the upper edges of the plates is cut out to prevent communication between the inside of the flat hollow body (3) and the operating temperature (14). In this case, an air reservoir (14) is provided, but this is not necessarily necessary.In this case, the entire periphery of a pair of opposing plates (2) is joined via a connecting wall, Seal the space between plates (2).

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention; FIG. 1 is a partially cutaway front view, FIG. 2 is a sectional view taken along the line ■-■ in FIG. 1, and FIG. 3 is a cross-sectional view taken along the line ■-■ in FIG. 1. Figure 4 is a cross-sectional view of Figure 1.
FIG. 5 is a vertical sectional view of the cooling fin, and FIG. 6 is a perspective view of the fins. (1)... Semiconductor element cooling device, (2)... Plate, (2a)... Hole, (3)... Flat hollow body, (4
)...Ring, (5)...Radiation fin, (6)...
・Plate fin, (7)...Connecting wall. Other 4 people Figure 2 Figure 4 Figure 6

Claims (1)

[Claims] A pair of plates (2) that are vertically long and have holes (2a) in their lower ends are disposed facing each other, and a small portion of the entire circumference of both plates (2) (both side edges and bottom Connecting wall (7) whose edges are arranged between both plates (2)
A vertically elongated flat hollow body (3) is connected to the bent part of the plate (2) through the J3.
A plurality of flat hollow bodies (3) are arranged in parallel,
A hole (2) is provided at the lower end between adjacent flat hollow bodies (3).
radiating fins (5) are connected to each other in a communicating manner by a ring (4) interposed to surround a
) is avoided, and the plate fin (
6) is fitted over and joined to the ring (4).