JPH034054Y2 - - Google Patents
Info
- Publication number
- JPH034054Y2 JPH034054Y2 JP1983102452U JP10245283U JPH034054Y2 JP H034054 Y2 JPH034054 Y2 JP H034054Y2 JP 1983102452 U JP1983102452 U JP 1983102452U JP 10245283 U JP10245283 U JP 10245283U JP H034054 Y2 JPH034054 Y2 JP H034054Y2
- Authority
- JP
- Japan
- Prior art keywords
- leadless chip
- chip component
- resin molded
- component mounting
- molded body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920003002 synthetic resin Polymers 0.000 claims description 8
- 239000000057 synthetic resin Substances 0.000 claims description 8
- 238000005476 soldering Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10245283U JPS6011466U (ja) | 1983-06-30 | 1983-06-30 | リ−ドレスチツプ部品取付装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10245283U JPS6011466U (ja) | 1983-06-30 | 1983-06-30 | リ−ドレスチツプ部品取付装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6011466U JPS6011466U (ja) | 1985-01-25 |
JPH034054Y2 true JPH034054Y2 (de) | 1991-02-01 |
Family
ID=30241477
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10245283U Granted JPS6011466U (ja) | 1983-06-30 | 1983-06-30 | リ−ドレスチツプ部品取付装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6011466U (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6962282B2 (ja) * | 2018-06-27 | 2021-11-05 | 株式会社村田製作所 | 積層セラミック電子部品 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55105277U (de) * | 1979-01-19 | 1980-07-23 |
-
1983
- 1983-06-30 JP JP10245283U patent/JPS6011466U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6011466U (ja) | 1985-01-25 |
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