JPH0340519B2 - - Google Patents
Info
- Publication number
- JPH0340519B2 JPH0340519B2 JP60016887A JP1688785A JPH0340519B2 JP H0340519 B2 JPH0340519 B2 JP H0340519B2 JP 60016887 A JP60016887 A JP 60016887A JP 1688785 A JP1688785 A JP 1688785A JP H0340519 B2 JPH0340519 B2 JP H0340519B2
- Authority
- JP
- Japan
- Prior art keywords
- aromatic
- wiring
- polyimide
- tetracarboxylic dianhydride
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60016887A JPS61176196A (ja) | 1985-01-31 | 1985-01-31 | モジユ−ル用配線基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60016887A JPS61176196A (ja) | 1985-01-31 | 1985-01-31 | モジユ−ル用配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61176196A JPS61176196A (ja) | 1986-08-07 |
JPH0340519B2 true JPH0340519B2 (enrdf_load_stackoverflow) | 1991-06-19 |
Family
ID=11928677
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60016887A Granted JPS61176196A (ja) | 1985-01-31 | 1985-01-31 | モジユ−ル用配線基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61176196A (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0316299Y2 (enrdf_load_stackoverflow) * | 1987-07-17 | 1991-04-08 | ||
JPH03196695A (ja) * | 1989-12-26 | 1991-08-28 | Fujitsu Ltd | 多層薄膜回路基板の製造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5846653A (ja) * | 1981-09-14 | 1983-03-18 | Fujitsu Ltd | 半導体装置 |
-
1985
- 1985-01-31 JP JP60016887A patent/JPS61176196A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61176196A (ja) | 1986-08-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4792476A (en) | Low thermal expansion resin material and composite shaped article | |
JPH0740629B2 (ja) | 電子装置用多層配線基板の製法 | |
US5570506A (en) | Method for forming multilayer wiring construction | |
JPH09324048A (ja) | ブロック成分を有するテトラポリイミドフィルム、その製造方法およびそれを基材として用いたテープ自動化接合用テープ | |
JPS60250031A (ja) | 低熱膨張性樹脂材料 | |
US5133989A (en) | Process for producing metal-polyimide composite article | |
JPS6032827A (ja) | 低熱膨張樹脂材料 | |
US6303230B1 (en) | Laminates | |
US5120573A (en) | Process for producing metal/polyimide composite article | |
JPS61181829A (ja) | 低熱膨張性樹脂材料 | |
EP0389195A2 (en) | A process of forming a patterned polyimide film and articles including such a film | |
JPH0340519B2 (enrdf_load_stackoverflow) | ||
JP3506468B2 (ja) | マルチチップモジュール用配線板 | |
JPH0245998A (ja) | 薄膜多層配線基板 | |
JPH0543314B2 (enrdf_load_stackoverflow) | ||
JPH0796618B2 (ja) | 低熱膨張性樹脂 | |
JPS6044338A (ja) | 複合成形品 | |
JP3602206B2 (ja) | 配線構造体とその製造法 | |
JPH024631B2 (enrdf_load_stackoverflow) | ||
JPS62176135A (ja) | 樹脂膜のエツチング方法 | |
JPS60143649A (ja) | 半導体装置の多層配線構造 | |
JPH05275417A (ja) | 配線構造体とその製造法 | |
JPS63234589A (ja) | 多層配線板 | |
JPH068036B2 (ja) | 金属/ポリイミド複合体の製造方法 | |
JPS61181828A (ja) | 低熱膨張性樹脂材料 |