JPH0340508B2 - - Google Patents
Info
- Publication number
- JPH0340508B2 JPH0340508B2 JP21273686A JP21273686A JPH0340508B2 JP H0340508 B2 JPH0340508 B2 JP H0340508B2 JP 21273686 A JP21273686 A JP 21273686A JP 21273686 A JP21273686 A JP 21273686A JP H0340508 B2 JPH0340508 B2 JP H0340508B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- electrode body
- printed wiring
- wiring board
- flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 69
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 18
- 239000004020 conductor Substances 0.000 description 17
- 230000000694 effects Effects 0.000 description 9
- 230000008602 contraction Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 238000005476 soldering Methods 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 229910000833 kovar Inorganic materials 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21273686A JPS6370449A (ja) | 1986-09-11 | 1986-09-11 | リ−ドレスパツケ−ジ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21273686A JPS6370449A (ja) | 1986-09-11 | 1986-09-11 | リ−ドレスパツケ−ジ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6370449A JPS6370449A (ja) | 1988-03-30 |
| JPH0340508B2 true JPH0340508B2 (enrdf_load_stackoverflow) | 1991-06-19 |
Family
ID=16627581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21273686A Granted JPS6370449A (ja) | 1986-09-11 | 1986-09-11 | リ−ドレスパツケ−ジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6370449A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4731232B2 (ja) * | 2005-07-22 | 2011-07-20 | パナソニック株式会社 | 電子素子用の表面実装ベース |
-
1986
- 1986-09-11 JP JP21273686A patent/JPS6370449A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6370449A (ja) | 1988-03-30 |
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