JPS6370449A - リ−ドレスパツケ−ジ - Google Patents

リ−ドレスパツケ−ジ

Info

Publication number
JPS6370449A
JPS6370449A JP21273686A JP21273686A JPS6370449A JP S6370449 A JPS6370449 A JP S6370449A JP 21273686 A JP21273686 A JP 21273686A JP 21273686 A JP21273686 A JP 21273686A JP S6370449 A JPS6370449 A JP S6370449A
Authority
JP
Japan
Prior art keywords
glass
wiring board
printed wiring
flat
electrode body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21273686A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0340508B2 (enrdf_load_stackoverflow
Inventor
Yoshio Kagami
各務 嘉雄
Toshio Hashi
橋 利雄
Kenichi Ando
健一 安藤
Takeshi Shiratori
白鳥 武司
Tadashi Nishimura
正 西村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Fuji Denka Inc
Original Assignee
Fujitsu Ltd
Fuji Denka Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd, Fuji Denka Inc filed Critical Fujitsu Ltd
Priority to JP21273686A priority Critical patent/JPS6370449A/ja
Publication of JPS6370449A publication Critical patent/JPS6370449A/ja
Publication of JPH0340508B2 publication Critical patent/JPH0340508B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP21273686A 1986-09-11 1986-09-11 リ−ドレスパツケ−ジ Granted JPS6370449A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21273686A JPS6370449A (ja) 1986-09-11 1986-09-11 リ−ドレスパツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21273686A JPS6370449A (ja) 1986-09-11 1986-09-11 リ−ドレスパツケ−ジ

Publications (2)

Publication Number Publication Date
JPS6370449A true JPS6370449A (ja) 1988-03-30
JPH0340508B2 JPH0340508B2 (enrdf_load_stackoverflow) 1991-06-19

Family

ID=16627581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21273686A Granted JPS6370449A (ja) 1986-09-11 1986-09-11 リ−ドレスパツケ−ジ

Country Status (1)

Country Link
JP (1) JPS6370449A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007035723A (ja) * 2005-07-22 2007-02-08 Matsushita Electric Ind Co Ltd 電子素子用の表面実装ベース

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007035723A (ja) * 2005-07-22 2007-02-08 Matsushita Electric Ind Co Ltd 電子素子用の表面実装ベース

Also Published As

Publication number Publication date
JPH0340508B2 (enrdf_load_stackoverflow) 1991-06-19

Similar Documents

Publication Publication Date Title
US5933710A (en) Method of providing electrical connection between an integrated circuit die and a printed circuit board
JPH06268101A (ja) 半導体装置及びその製造方法、電子装置、リ−ドフレ−ム並びに実装基板
US4839713A (en) Package structure for semiconductor device
EP0623241B1 (en) Semiconductor device with terminal lead
JPH0773117B2 (ja) 半導体パッケ−ジ
JPS6370449A (ja) リ−ドレスパツケ−ジ
KR100246367B1 (ko) 반도체 패키지 및 그 제조방법
JPH0334861B2 (enrdf_load_stackoverflow)
JPS62158348A (ja) リ−ドレスパツケ−ジ
JP2782640B2 (ja) 半導体装置の内部接続構造
JP3556449B2 (ja) 連結リードピン
JP2853695B2 (ja) チップキャリア及び半導体集積回路装置
JPH05291739A (ja) 接続用端子及びこれを用いた装置の接続方法
JP3441170B2 (ja) 配線基板
JP2543153Y2 (ja) 半導体素子収納用パッケージ
JPS638620B2 (enrdf_load_stackoverflow)
JP3020783B2 (ja) 半導体素子収納用パッケージ
JP4290833B2 (ja) 半導体素子収納用パッケージ
JP2004281471A (ja) 配線基板
JPH05226507A (ja) 表面実装型半導体素子パッケージ
JPH06326153A (ja) チップデバイス
JPH0528017U (ja) 表面実装型電子部品
JPH0585051U (ja) Icパッケージ
JPH04208556A (ja) 半導体装置パッケージ
JP2002231841A (ja) 半導体素子収納用パッケージ