JPH0340506B2 - - Google Patents
Info
- Publication number
- JPH0340506B2 JPH0340506B2 JP10277885A JP10277885A JPH0340506B2 JP H0340506 B2 JPH0340506 B2 JP H0340506B2 JP 10277885 A JP10277885 A JP 10277885A JP 10277885 A JP10277885 A JP 10277885A JP H0340506 B2 JPH0340506 B2 JP H0340506B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- heat
- heat dissipation
- fin
- protrusions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 39
- 230000017525 heat dissipation Effects 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 10
- 238000005219 brazing Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 238000003825 pressing Methods 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10277885A JPS61263140A (ja) | 1985-05-16 | 1985-05-16 | アルミニウム製放熱体の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10277885A JPS61263140A (ja) | 1985-05-16 | 1985-05-16 | アルミニウム製放熱体の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61263140A JPS61263140A (ja) | 1986-11-21 |
| JPH0340506B2 true JPH0340506B2 (US06373033-20020416-M00071.png) | 1991-06-19 |
Family
ID=14336604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10277885A Granted JPS61263140A (ja) | 1985-05-16 | 1985-05-16 | アルミニウム製放熱体の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61263140A (US06373033-20020416-M00071.png) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6749009B2 (en) * | 2002-02-20 | 2004-06-15 | Delphi Technologies, Inc. | Folded fin on edge heat sink |
| US20100206536A1 (en) * | 2007-04-24 | 2010-08-19 | Claus Peter Kluge | Method for producing a composite including at least one non-flat component |
| CN102522381B (zh) * | 2011-12-22 | 2015-09-30 | 东莞汉旭五金塑胶科技有限公司 | 一种散热器及其制造方法 |
| AT520072B1 (de) * | 2017-07-28 | 2019-01-15 | Zkw Group Gmbh | Kühlkörper und Fahrzeugscheinwerfer |
-
1985
- 1985-05-16 JP JP10277885A patent/JPS61263140A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61263140A (ja) | 1986-11-21 |
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