JPH0340505B2 - - Google Patents
Info
- Publication number
- JPH0340505B2 JPH0340505B2 JP13685181A JP13685181A JPH0340505B2 JP H0340505 B2 JPH0340505 B2 JP H0340505B2 JP 13685181 A JP13685181 A JP 13685181A JP 13685181 A JP13685181 A JP 13685181A JP H0340505 B2 JPH0340505 B2 JP H0340505B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- heating element
- heat
- semiconductor heating
- divided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 35
- 238000010438 heat treatment Methods 0.000 claims description 26
- 230000017525 heat dissipation Effects 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/345—Arrangements for heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13685181A JPS5839042A (ja) | 1981-08-31 | 1981-08-31 | 半導体ヒ−タ装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13685181A JPS5839042A (ja) | 1981-08-31 | 1981-08-31 | 半導体ヒ−タ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5839042A JPS5839042A (ja) | 1983-03-07 |
JPH0340505B2 true JPH0340505B2 (US20110232667A1-20110929-C00004.png) | 1991-06-19 |
Family
ID=15184982
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13685181A Granted JPS5839042A (ja) | 1981-08-31 | 1981-08-31 | 半導体ヒ−タ装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5839042A (US20110232667A1-20110929-C00004.png) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS649017A (en) * | 1987-05-01 | 1989-01-12 | Texas Instruments Inc | Vehicle and air heater therefor |
JP2556877B2 (ja) * | 1988-03-10 | 1996-11-27 | 株式会社村田製作所 | 正特性サーミスタ装置 |
DE3869773C5 (de) * | 1988-07-15 | 2010-06-24 | Dbk David + Baader Gmbh | Radiator. |
GB2375431B (en) * | 2001-05-10 | 2003-11-05 | Bookham Technology Plc | Method and device for balancing temperature |
-
1981
- 1981-08-31 JP JP13685181A patent/JPS5839042A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5839042A (ja) | 1983-03-07 |
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