JPH0340052B2 - - Google Patents

Info

Publication number
JPH0340052B2
JPH0340052B2 JP61250300A JP25030086A JPH0340052B2 JP H0340052 B2 JPH0340052 B2 JP H0340052B2 JP 61250300 A JP61250300 A JP 61250300A JP 25030086 A JP25030086 A JP 25030086A JP H0340052 B2 JPH0340052 B2 JP H0340052B2
Authority
JP
Japan
Prior art keywords
epoxy resin
epoxy
curing
present
curing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61250300A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62201922A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS62201922A publication Critical patent/JPS62201922A/ja
Publication of JPH0340052B2 publication Critical patent/JPH0340052B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP25030086A 1985-10-31 1986-10-21 エポキシ樹脂組成物 Granted JPS62201922A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60-244769 1985-10-31
JP60244769 1985-10-31

Publications (2)

Publication Number Publication Date
JPS62201922A JPS62201922A (ja) 1987-09-05
JPH0340052B2 true JPH0340052B2 (en, 2012) 1991-06-17

Family

ID=17123631

Family Applications (2)

Application Number Title Priority Date Filing Date
JP25030186A Granted JPS62201923A (ja) 1985-10-31 1986-10-21 エポキシ樹脂組成物
JP25030086A Granted JPS62201922A (ja) 1985-10-31 1986-10-21 エポキシ樹脂組成物

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP25030186A Granted JPS62201923A (ja) 1985-10-31 1986-10-21 エポキシ樹脂組成物

Country Status (1)

Country Link
JP (2) JPS62201923A (en, 2012)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01105562A (ja) * 1987-10-19 1989-04-24 Sumitomo Bakelite Co Ltd 樹脂封止型半導体装置
JPH0689112B2 (ja) * 1989-11-25 1994-11-09 松下電工株式会社 半導体封止用エポキシ樹脂組成物
JPH0689113B2 (ja) * 1989-11-27 1994-11-09 松下電工株式会社 半導体封止用エポキシ樹脂組成物
JPH0597970A (ja) * 1991-10-07 1993-04-20 Shin Etsu Chem Co Ltd 熱硬化性樹脂組成物及び半導体装置
JP2643706B2 (ja) * 1991-11-26 1997-08-20 信越化学工業株式会社 熱硬化性樹脂組成物及び半導体装置
SG41939A1 (en) 1994-10-07 1997-08-15 Shell Int Research Epoxy resin composition for semiconductor encapsulation
JPH10245473A (ja) * 1997-03-03 1998-09-14 Yuka Shell Epoxy Kk エポキシ樹脂組成物
KR100421927B1 (ko) * 2001-08-21 2004-03-12 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물
KR100480945B1 (ko) * 2001-12-28 2005-04-06 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물
EP2284216B1 (en) 2009-08-07 2012-03-28 Ticona LLC Low formaldehyde emission polyacetal composition
JP6422777B2 (ja) 2011-09-29 2018-11-14 ティコナ・エルエルシー 金属様外観を呈する物品の製造用重合体組成物

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS603340B2 (ja) * 1978-01-20 1985-01-28 日石三菱株式会社 エポキシ樹脂組成物

Also Published As

Publication number Publication date
JPH0340053B2 (en, 2012) 1991-06-17
JPS62201922A (ja) 1987-09-05
JPS62201923A (ja) 1987-09-05

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees