JPH0338952Y2 - - Google Patents
Info
- Publication number
- JPH0338952Y2 JPH0338952Y2 JP1986012885U JP1288586U JPH0338952Y2 JP H0338952 Y2 JPH0338952 Y2 JP H0338952Y2 JP 1986012885 U JP1986012885 U JP 1986012885U JP 1288586 U JP1288586 U JP 1288586U JP H0338952 Y2 JPH0338952 Y2 JP H0338952Y2
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- adhesive layer
- pattern
- sensitive adhesive
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010410 layer Substances 0.000 claims description 39
- 239000011888 foil Substances 0.000 claims description 27
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 19
- 229920001971 elastomer Polymers 0.000 claims description 16
- 229910000510 noble metal Inorganic materials 0.000 claims description 9
- 239000012790 adhesive layer Substances 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 7
- 229910052737 gold Inorganic materials 0.000 description 7
- 239000010931 gold Substances 0.000 description 7
- 239000004973 liquid crystal related substance Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000010970 precious metal Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229910001020 Au alloy Inorganic materials 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010073 coating (rubber) Methods 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986012885U JPH0338952Y2 (enrdf_load_stackoverflow) | 1986-01-31 | 1986-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986012885U JPH0338952Y2 (enrdf_load_stackoverflow) | 1986-01-31 | 1986-01-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62126071U JPS62126071U (enrdf_load_stackoverflow) | 1987-08-10 |
| JPH0338952Y2 true JPH0338952Y2 (enrdf_load_stackoverflow) | 1991-08-16 |
Family
ID=30801433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986012885U Expired JPH0338952Y2 (enrdf_load_stackoverflow) | 1986-01-31 | 1986-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0338952Y2 (enrdf_load_stackoverflow) |
-
1986
- 1986-01-31 JP JP1986012885U patent/JPH0338952Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62126071U (enrdf_load_stackoverflow) | 1987-08-10 |
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