JPH0338837Y2 - - Google Patents
Info
- Publication number
- JPH0338837Y2 JPH0338837Y2 JP9685585U JP9685585U JPH0338837Y2 JP H0338837 Y2 JPH0338837 Y2 JP H0338837Y2 JP 9685585 U JP9685585 U JP 9685585U JP 9685585 U JP9685585 U JP 9685585U JP H0338837 Y2 JPH0338837 Y2 JP H0338837Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- case
- metal plate
- sealed
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 28
- 239000011347 resin Substances 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 238000000465 moulding Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9685585U JPH0338837Y2 (US20020095090A1-20020718-M00002.png) | 1985-06-26 | 1985-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9685585U JPH0338837Y2 (US20020095090A1-20020718-M00002.png) | 1985-06-26 | 1985-06-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS625646U JPS625646U (US20020095090A1-20020718-M00002.png) | 1987-01-14 |
| JPH0338837Y2 true JPH0338837Y2 (US20020095090A1-20020718-M00002.png) | 1991-08-15 |
Family
ID=30963103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9685585U Expired JPH0338837Y2 (US20020095090A1-20020718-M00002.png) | 1985-06-26 | 1985-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0338837Y2 (US20020095090A1-20020718-M00002.png) |
-
1985
- 1985-06-26 JP JP9685585U patent/JPH0338837Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS625646U (US20020095090A1-20020718-M00002.png) | 1987-01-14 |
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