JPH0338744B2 - - Google Patents

Info

Publication number
JPH0338744B2
JPH0338744B2 JP57197490A JP19749082A JPH0338744B2 JP H0338744 B2 JPH0338744 B2 JP H0338744B2 JP 57197490 A JP57197490 A JP 57197490A JP 19749082 A JP19749082 A JP 19749082A JP H0338744 B2 JPH0338744 B2 JP H0338744B2
Authority
JP
Japan
Prior art keywords
gap
semiconductor
heat sink
thermally conductive
conductive liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57197490A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5987843A (ja
Inventor
Noryuki Ashiwake
Takahiro Ooguro
Keizo Kawamura
Toshihiro Yamada
Motohiro Sato
Asao Nishimura
Hisashi Nakayama
Shigeru Shida
Fumyuki Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57197490A priority Critical patent/JPS5987843A/ja
Publication of JPS5987843A publication Critical patent/JPS5987843A/ja
Publication of JPH0338744B2 publication Critical patent/JPH0338744B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/258—
    • H10W72/877—
    • H10W90/724—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP57197490A 1982-11-12 1982-11-12 半導体冷却装置 Granted JPS5987843A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57197490A JPS5987843A (ja) 1982-11-12 1982-11-12 半導体冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57197490A JPS5987843A (ja) 1982-11-12 1982-11-12 半導体冷却装置

Publications (2)

Publication Number Publication Date
JPS5987843A JPS5987843A (ja) 1984-05-21
JPH0338744B2 true JPH0338744B2 (enExample) 1991-06-11

Family

ID=16375333

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57197490A Granted JPS5987843A (ja) 1982-11-12 1982-11-12 半導体冷却装置

Country Status (1)

Country Link
JP (1) JPS5987843A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0821646B2 (ja) * 1986-04-04 1996-03-04 日本電気株式会社 集積回路の冷却構造の形成方法
US5006924A (en) * 1989-12-29 1991-04-09 International Business Machines Corporation Heat sink for utilization with high density integrated circuit substrates
CA2070743A1 (en) * 1991-06-18 1992-12-19 Masanori Nishiguchi Semiconductor chip module and method for manufacturing the same
CA2072377A1 (en) * 1991-07-12 1993-01-13 Masanori Nishiguchi Semiconductor chip module and method of manufacturing the same
JPH06349989A (ja) * 1992-12-21 1994-12-22 Internatl Business Mach Corp <Ibm> 熱伝達冷却装置

Also Published As

Publication number Publication date
JPS5987843A (ja) 1984-05-21

Similar Documents

Publication Publication Date Title
US4561011A (en) Dimensionally stable semiconductor device
JP3018554B2 (ja) 半導体モジュ−ル及びその製造方法
JP3454888B2 (ja) 電子部品ユニット及びその製造方法
US5387815A (en) Semiconductor chip module
US20050280142A1 (en) Electronic assembly having an indium wetting layer on a thermally conductive body
JP4908733B2 (ja) 集積回路装置の活性区域から熱を除去する方法及びシステム
GB1569453A (en) Circuit packages and methods for making circuits packages
JPH04230057A (ja) 熱放散装置およびその方法
EP1472916A1 (en) Electronic assembly having composite electronic contacts for attaching a package substrate to a printed circuit board
JPH06196598A (ja) 半導体チップの実装構造
JPH0338744B2 (enExample)
US20060273467A1 (en) Flip chip package and method of conducting heat therefrom
TW202339146A (zh) 半導體裝置及其製造方法
JPH11111897A (ja) マルチチップ型半導体装置
JP2847949B2 (ja) 半導体装置
EP0523387A2 (en) Semiconductor chip module and method for manufacturing the same
JPS6092642A (ja) 半導体装置の強制冷却装置
JP3265544B2 (ja) 半導体チップの実装構造
JPH0661368A (ja) フリップチップ型半導体装置
CN222088581U (zh) 电子封装件
JPH01152637A (ja) 半導体素子の実装方法
JPH01132146A (ja) 半導体装置
JPH0573061B2 (enExample)
JPS63228650A (ja) 発熱素子用冷却装置
JP3398276B2 (ja) ランドグリッドアレイ型パッケージの実装構造