JPH033751U - - Google Patents

Info

Publication number
JPH033751U
JPH033751U JP6375189U JP6375189U JPH033751U JP H033751 U JPH033751 U JP H033751U JP 6375189 U JP6375189 U JP 6375189U JP 6375189 U JP6375189 U JP 6375189U JP H033751 U JPH033751 U JP H033751U
Authority
JP
Japan
Prior art keywords
chip
container
electronic component
outside
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6375189U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6375189U priority Critical patent/JPH033751U/ja
Publication of JPH033751U publication Critical patent/JPH033751U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】
第1図は本考案の金属シール型電子部品の1実
施例を示す断面図、第2図は第1図の金属シール
型電子部品の印刷配線板への取付状態を示す側面
図である。 10……訓属シール型電子部品、12……チツ
プ、14……容器、20……端子、26……突部

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体チツプなどのチツプと、該チツプを収容
    しかつ外気から遮断する容器と、一端が前記チツ
    プに接続され、前記容器を貫通して外部に伸びる
    複数の端子とを備え、前記端子の外部部分の外周
    面に突部が設けられている金属シール型電子部品
JP6375189U 1989-05-31 1989-05-31 Pending JPH033751U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6375189U JPH033751U (ja) 1989-05-31 1989-05-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6375189U JPH033751U (ja) 1989-05-31 1989-05-31

Publications (1)

Publication Number Publication Date
JPH033751U true JPH033751U (ja) 1991-01-16

Family

ID=31594077

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6375189U Pending JPH033751U (ja) 1989-05-31 1989-05-31

Country Status (1)

Country Link
JP (1) JPH033751U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015103566A (ja) * 2013-11-21 2015-06-04 三菱電機株式会社 半導体装置、半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015103566A (ja) * 2013-11-21 2015-06-04 三菱電機株式会社 半導体装置、半導体装置の製造方法

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