JPH033751U - - Google Patents
Info
- Publication number
- JPH033751U JPH033751U JP6375189U JP6375189U JPH033751U JP H033751 U JPH033751 U JP H033751U JP 6375189 U JP6375189 U JP 6375189U JP 6375189 U JP6375189 U JP 6375189U JP H033751 U JPH033751 U JP H033751U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- container
- electronic component
- outside
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の金属シール型電子部品の１実
施例を示す断面図、第２図は第１図の金属シール
型電子部品の印刷配線板への取付状態を示す側面
図である。 １０……訓属シール型電子部品、１２……チツ
プ、１４……容器、２０……端子、２６……突部
。
施例を示す断面図、第２図は第１図の金属シール
型電子部品の印刷配線板への取付状態を示す側面
図である。 １０……訓属シール型電子部品、１２……チツ
プ、１４……容器、２０……端子、２６……突部
。
Claims (1)
- 半導体チツプなどのチツプと、該チツプを収容
しかつ外気から遮断する容器と、一端が前記チツ
プに接続され、前記容器を貫通して外部に伸びる
複数の端子とを備え、前記端子の外部部分の外周
面に突部が設けられている金属シール型電子部品
。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6375189U JPH033751U (ja) | 1989-05-31 | 1989-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6375189U JPH033751U (ja) | 1989-05-31 | 1989-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH033751U true JPH033751U (ja) | 1991-01-16 |
Family
ID=31594077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6375189U Pending JPH033751U (ja) | 1989-05-31 | 1989-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH033751U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015103566A (ja) * | 2013-11-21 | 2015-06-04 | 三菱電機株式会社 | 半導体装置、半導体装置の製造方法 |
-
1989
- 1989-05-31 JP JP6375189U patent/JPH033751U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015103566A (ja) * | 2013-11-21 | 2015-06-04 | 三菱電機株式会社 | 半導体装置、半導体装置の製造方法 |