JPH0337470B2 - - Google Patents
Info
- Publication number
- JPH0337470B2 JPH0337470B2 JP10715285A JP10715285A JPH0337470B2 JP H0337470 B2 JPH0337470 B2 JP H0337470B2 JP 10715285 A JP10715285 A JP 10715285A JP 10715285 A JP10715285 A JP 10715285A JP H0337470 B2 JPH0337470 B2 JP H0337470B2
- Authority
- JP
- Japan
- Prior art keywords
- contact chip
- ceramic
- arc welding
- coating layer
- ceramic contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 claims description 75
- 238000003466 welding Methods 0.000 claims description 66
- 238000000034 method Methods 0.000 claims description 39
- 239000004020 conductor Substances 0.000 claims description 32
- 239000011247 coating layer Substances 0.000 claims description 28
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 20
- 238000004519 manufacturing process Methods 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 17
- 238000005452 bending Methods 0.000 claims description 7
- 238000007750 plasma spraying Methods 0.000 claims description 7
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 6
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 5
- 239000010410 layer Substances 0.000 claims description 5
- 239000012799 electrically-conductive coating Substances 0.000 claims description 3
- 230000000704 physical effect Effects 0.000 claims description 3
- 229910001020 Au alloy Inorganic materials 0.000 claims description 2
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 2
- 229910001260 Pt alloy Inorganic materials 0.000 claims description 2
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 2
- 239000003353 gold alloy Substances 0.000 claims description 2
- 239000010936 titanium Substances 0.000 description 14
- 238000000576 coating method Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 8
- 238000009713 electroplating Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 238000000465 moulding Methods 0.000 description 8
- 238000005240 physical vapour deposition Methods 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 239000000843 powder Substances 0.000 description 7
- 239000010949 copper Substances 0.000 description 6
- 230000009257 reactivity Effects 0.000 description 6
- 238000000137 annealing Methods 0.000 description 5
- 238000007772 electroless plating Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 239000012778 molding material Substances 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910017526 Cu-Cr-Zr Inorganic materials 0.000 description 1
- 229910017810 Cu—Cr—Zr Inorganic materials 0.000 description 1
- 229910017309 Mo—Mn Inorganic materials 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000005524 ceramic coating Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 230000003031 feeding effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 229920001490 poly(butyl methacrylate) polymer Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 235000011118 potassium hydroxide Nutrition 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Landscapes
- Other Surface Treatments For Metallic Materials (AREA)
- Arc Welding In General (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10715285A JPS61266189A (ja) | 1985-05-20 | 1985-05-20 | ア−ク溶接用セラミツクコンタクトチツプおよびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10715285A JPS61266189A (ja) | 1985-05-20 | 1985-05-20 | ア−ク溶接用セラミツクコンタクトチツプおよびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61266189A JPS61266189A (ja) | 1986-11-25 |
| JPH0337470B2 true JPH0337470B2 (zh) | 1991-06-05 |
Family
ID=14451824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10715285A Granted JPS61266189A (ja) | 1985-05-20 | 1985-05-20 | ア−ク溶接用セラミツクコンタクトチツプおよびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61266189A (zh) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63188477A (ja) * | 1987-01-29 | 1988-08-04 | Kyocera Corp | 熔接用案内通電部材 |
| WO1990013685A1 (fr) * | 1989-05-10 | 1990-11-15 | Furukawa Electric Co., Ltd. | Materiau de contact electrique, procede de production de ce materiau, et contact electrique ainsi produit |
| US20100320184A1 (en) * | 2009-06-19 | 2010-12-23 | Lincoln Global, Inc. | Welding contact tip and welding gun incorporating the same |
| JP5887473B2 (ja) * | 2011-04-12 | 2016-03-16 | パナソニックＩｐマネジメント株式会社 | 溶接用コンタクトチップ |
| JP6559454B2 (ja) * | 2015-04-02 | 2019-08-14 | 株式会社東芝 | レーザ溶接ヘッド |
| JP2019136768A (ja) * | 2018-02-08 | 2019-08-22 | 新光機器株式会社 | コンタクトチップ |
| CN111136405B (zh) * | 2020-01-17 | 2021-02-23 | 西南交通大学 | 一种核电高温镍基合金复合焊丝的制备方法及其产品 |
-
1985
- 1985-05-20 JP JP10715285A patent/JPS61266189A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61266189A (ja) | 1986-11-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI260249B (en) | Nozzle for processing machine, contact chip for welding, method for manufacturing nozzle for processing machine and method for manufacturing contact chip for welding | |
| JPH0337470B2 (zh) | ||
| KR20010020671A (ko) | 와이어 전극 | |
| JP4881049B2 (ja) | 電気メッキ用コンダクターロール | |
| JP5083930B2 (ja) | スポット溶接用電極 | |
| HU189862B (en) | Method for making electric contact | |
| JPH0418950B2 (zh) | ||
| JP2001150247A (ja) | ワイヤ放電加工用電極線 | |
| JP2015014036A (ja) | 抵抗溶接用電極 | |
| JPS60227997A (ja) | 溶接用電極材料 | |
| JPS60227998A (ja) | 溶接用電極材料 | |
| JPH0337471B2 (zh) | ||
| JP2000345313A (ja) | 繰り返し熱衝撃及び摺動摩耗を受けるロール胴部基材表面の耐熱性、耐食性、耐摩耗性を向上させた連続鋳造に用いるロール製造法 | |
| JPS60231596A (ja) | 溶接用電極材料 | |
| JP3846960B2 (ja) | 溶接トーチ用部材およびその製造方法 | |
| EA008523B1 (ru) | Способ получения хорошей поверхности контакта на катодной несущей штанге и несущая штанга | |
| JP6298247B2 (ja) | 抵抗溶接用電極 | |
| JPH03151170A (ja) | ハンダめっき線溶接用チャック | |
| JPH0342024Y2 (zh) | ||
| KR20210080640A (ko) | 저항 용접용 코팅 전극 및 그 제조 방법 | |
| JP3888077B2 (ja) | 金属接合用電極及びその製造方法、並びに金属接合用電極を備えた溶接設備及びそれにより溶接された製品 | |
| JPH0442067Y2 (zh) | ||
| JPH05300Y2 (zh) | ||
| JPH0442066Y2 (zh) | ||
| JPS62101388A (ja) | スポツト溶接用電極 |