JPH0337312B2 - - Google Patents

Info

Publication number
JPH0337312B2
JPH0337312B2 JP60254041A JP25404185A JPH0337312B2 JP H0337312 B2 JPH0337312 B2 JP H0337312B2 JP 60254041 A JP60254041 A JP 60254041A JP 25404185 A JP25404185 A JP 25404185A JP H0337312 B2 JPH0337312 B2 JP H0337312B2
Authority
JP
Japan
Prior art keywords
heat
heat pipe
semiconductor element
heat dissipation
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60254041A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62113453A (ja
Inventor
Kenji Baba
Takashi Murase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Fuji Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd, Fuji Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP60254041A priority Critical patent/JPS62113453A/ja
Publication of JPS62113453A publication Critical patent/JPS62113453A/ja
Publication of JPH0337312B2 publication Critical patent/JPH0337312B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60254041A 1985-11-13 1985-11-13 平形半導体素子のヒ−トパイプ式冷却体 Granted JPS62113453A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60254041A JPS62113453A (ja) 1985-11-13 1985-11-13 平形半導体素子のヒ−トパイプ式冷却体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60254041A JPS62113453A (ja) 1985-11-13 1985-11-13 平形半導体素子のヒ−トパイプ式冷却体

Publications (2)

Publication Number Publication Date
JPS62113453A JPS62113453A (ja) 1987-05-25
JPH0337312B2 true JPH0337312B2 (enExample) 1991-06-05

Family

ID=17259414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60254041A Granted JPS62113453A (ja) 1985-11-13 1985-11-13 平形半導体素子のヒ−トパイプ式冷却体

Country Status (1)

Country Link
JP (1) JPS62113453A (enExample)

Also Published As

Publication number Publication date
JPS62113453A (ja) 1987-05-25

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