JPH033551B2 - - Google Patents
Info
- Publication number
- JPH033551B2 JPH033551B2 JP58213931A JP21393183A JPH033551B2 JP H033551 B2 JPH033551 B2 JP H033551B2 JP 58213931 A JP58213931 A JP 58213931A JP 21393183 A JP21393183 A JP 21393183A JP H033551 B2 JPH033551 B2 JP H033551B2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- plating
- solution
- laser beam
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58213931A JPS60106689A (ja) | 1983-11-16 | 1983-11-16 | レ−ザ加工装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58213931A JPS60106689A (ja) | 1983-11-16 | 1983-11-16 | レ−ザ加工装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60106689A JPS60106689A (ja) | 1985-06-12 |
| JPH033551B2 true JPH033551B2 (de) | 1991-01-18 |
Family
ID=16647409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58213931A Granted JPS60106689A (ja) | 1983-11-16 | 1983-11-16 | レ−ザ加工装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60106689A (de) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0230393A (ja) * | 1988-07-19 | 1990-01-31 | Fujita Corp | レーザ照射ビームの吸収安全装置 |
| CN106181078A (zh) * | 2016-07-19 | 2016-12-07 | 武汉华工激光工程有限责任公司 | 一种水冷治具装置及其使用方法 |
| JP2018040033A (ja) * | 2016-09-07 | 2018-03-15 | 株式会社スギノマシン | レーザアブレーションによる金属ナノコロイド生成方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59225896A (ja) * | 1983-06-06 | 1984-12-18 | Semiconductor Energy Lab Co Ltd | レ−ザ加工方法 |
-
1983
- 1983-11-16 JP JP58213931A patent/JPS60106689A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60106689A (ja) | 1985-06-12 |
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