JPH0334658B2 - - Google Patents

Info

Publication number
JPH0334658B2
JPH0334658B2 JP58102906A JP10290683A JPH0334658B2 JP H0334658 B2 JPH0334658 B2 JP H0334658B2 JP 58102906 A JP58102906 A JP 58102906A JP 10290683 A JP10290683 A JP 10290683A JP H0334658 B2 JPH0334658 B2 JP H0334658B2
Authority
JP
Japan
Prior art keywords
card
conductive layer
module
terminal
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58102906A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59228743A (ja
Inventor
Yoshihiko Nakahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyodo Printing Co Ltd
Original Assignee
Kyodo Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyodo Printing Co Ltd filed Critical Kyodo Printing Co Ltd
Priority to JP58102906A priority Critical patent/JPS59228743A/ja
Publication of JPS59228743A publication Critical patent/JPS59228743A/ja
Publication of JPH0334658B2 publication Critical patent/JPH0334658B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • G06K19/07747Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60Protection against electrostatic charges or discharges, e.g. Faraday shields
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3025Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Credit Cards Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP58102906A 1983-06-10 1983-06-10 Icカ−ド用icモジユ−ル Granted JPS59228743A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58102906A JPS59228743A (ja) 1983-06-10 1983-06-10 Icカ−ド用icモジユ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58102906A JPS59228743A (ja) 1983-06-10 1983-06-10 Icカ−ド用icモジユ−ル

Publications (2)

Publication Number Publication Date
JPS59228743A JPS59228743A (ja) 1984-12-22
JPH0334658B2 true JPH0334658B2 (ko) 1991-05-23

Family

ID=14339902

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58102906A Granted JPS59228743A (ja) 1983-06-10 1983-06-10 Icカ−ド用icモジユ−ル

Country Status (1)

Country Link
JP (1) JPS59228743A (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0696356B2 (ja) * 1986-03-17 1994-11-30 三菱電機株式会社 薄型半導体カード
JPS6339580U (ko) * 1986-09-02 1988-03-14
US5122860A (en) * 1987-08-26 1992-06-16 Matsushita Electric Industrial Co., Ltd. Integrated circuit device and manufacturing method thereof
JP3016884B2 (ja) * 1991-02-06 2000-03-06 ローム株式会社 サーマルヘッド
DE4126874C2 (de) * 1991-08-14 1997-05-22 Orga Kartensysteme Gmbh Datenträger mit integriertem Schaltkreis
JP3173171B2 (ja) * 1991-12-19 2001-06-04 カシオ計算機株式会社 情報転送システム
US5544014A (en) * 1992-08-12 1996-08-06 Oki Electric Industry Co., Ltd. IC card having a built-in semiconductor integrated circuit device
JPH06183189A (ja) * 1992-12-21 1994-07-05 Toppan Printing Co Ltd Icカード用icモジュール
ATE196813T1 (de) * 1993-10-08 2000-10-15 Valtac Alex Beaud Speicheranordnung
DE4344297A1 (de) * 1993-12-23 1995-06-29 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Ausweiskarten
FR2806189B1 (fr) * 2000-03-10 2002-05-31 Schlumberger Systems & Service Circuit integre renforce et procede de renforcement de circuits integres
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5660098A (en) * 1979-10-23 1981-05-23 Hokushin Electric Works Method of electrostatically shielding electronic circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5660098A (en) * 1979-10-23 1981-05-23 Hokushin Electric Works Method of electrostatically shielding electronic circuit

Also Published As

Publication number Publication date
JPS59228743A (ja) 1984-12-22

Similar Documents

Publication Publication Date Title
US4677528A (en) Flexible printed circuit board having integrated circuit die or the like affixed thereto
KR910008393B1 (ko) 데이타 메모리를 포함하는 ic를 내장한 카드
JPH0634152Y2 (ja) 多機能カード
TW589930B (en) Electrostatic discharge protection device for a high density printed circuit board
TW529155B (en) Semiconductor device, semiconductor device package and a method of manufacturing a semiconductor device
JPH0643158B2 (ja) Icモジュ−ル付識別カ−ド
US6235553B1 (en) Method and system for creating and using an electrostatic discharge (ESD) protected logotype contact module with a smart card
TW383477B (en) Semiconductor device
JPH0334658B2 (ko)
US4794243A (en) Integrated circuit card with increased number of connecting terminals
GB2204182A (en) Ic card
JP2744923B2 (ja) 電子回路を具える装置
JPS59229400A (ja) Icカ−ド
CN107484403A (zh) 屏蔽罩、电路板组件以及电子设备
JPS5922355A (ja) Icカ−ド
TW426924B (en) Land-side mounting of components to an integrated circuit package
CN206350065U (zh) 一种摄像头模组
JPS6091489A (ja) 静電対策icカ−ド
JP2514318B2 (ja) Icカ−ド
JPH0738240A (ja) ハイブリッド集積回路装置の構造
JPS622706Y2 (ko)
JPH06183189A (ja) Icカード用icモジュール
JPS6225812Y2 (ko)
JPS6239474Y2 (ko)
JPS6297896A (ja) Icカ−ド