JPH0334214B2 - - Google Patents

Info

Publication number
JPH0334214B2
JPH0334214B2 JP60267501A JP26750185A JPH0334214B2 JP H0334214 B2 JPH0334214 B2 JP H0334214B2 JP 60267501 A JP60267501 A JP 60267501A JP 26750185 A JP26750185 A JP 26750185A JP H0334214 B2 JPH0334214 B2 JP H0334214B2
Authority
JP
Japan
Prior art keywords
wafer
swinging
detection means
members
swinging member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60267501A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62128141A (ja
Inventor
Koji Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Canon Marketing Japan Inc
Original Assignee
Canon Inc
Canon Hanbai KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc, Canon Hanbai KK filed Critical Canon Inc
Priority to JP26750185A priority Critical patent/JPS62128141A/ja
Publication of JPS62128141A publication Critical patent/JPS62128141A/ja
Publication of JPH0334214B2 publication Critical patent/JPH0334214B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Control Of Position Or Direction (AREA)
JP26750185A 1985-11-29 1985-11-29 ウエハの位置合わせ装置 Granted JPS62128141A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26750185A JPS62128141A (ja) 1985-11-29 1985-11-29 ウエハの位置合わせ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26750185A JPS62128141A (ja) 1985-11-29 1985-11-29 ウエハの位置合わせ装置

Publications (2)

Publication Number Publication Date
JPS62128141A JPS62128141A (ja) 1987-06-10
JPH0334214B2 true JPH0334214B2 (enrdf_load_html_response) 1991-05-21

Family

ID=17445725

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26750185A Granted JPS62128141A (ja) 1985-11-29 1985-11-29 ウエハの位置合わせ装置

Country Status (1)

Country Link
JP (1) JPS62128141A (enrdf_load_html_response)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59145037U (ja) * 1983-03-17 1984-09-28 日本電子株式会社 ウエハの位置合わせ装置

Also Published As

Publication number Publication date
JPS62128141A (ja) 1987-06-10

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term