JPH0333068Y2 - - Google Patents
Info
- Publication number
- JPH0333068Y2 JPH0333068Y2 JP1985146750U JP14675085U JPH0333068Y2 JP H0333068 Y2 JPH0333068 Y2 JP H0333068Y2 JP 1985146750 U JP1985146750 U JP 1985146750U JP 14675085 U JP14675085 U JP 14675085U JP H0333068 Y2 JPH0333068 Y2 JP H0333068Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- resin
- stud
- packages
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000017525 heat dissipation Effects 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 20
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000010125 resin casting Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910018054 Ni-Cu Inorganic materials 0.000 description 1
- 229910018481 Ni—Cu Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- OFLYIWITHZJFLS-UHFFFAOYSA-N [Si].[Au] Chemical compound [Si].[Au] OFLYIWITHZJFLS-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985146750U JPH0333068Y2 (de) | 1985-09-26 | 1985-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985146750U JPH0333068Y2 (de) | 1985-09-26 | 1985-09-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6255354U JPS6255354U (de) | 1987-04-06 |
| JPH0333068Y2 true JPH0333068Y2 (de) | 1991-07-12 |
Family
ID=31059500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985146750U Expired JPH0333068Y2 (de) | 1985-09-26 | 1985-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0333068Y2 (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7772036B2 (en) * | 2006-04-06 | 2010-08-10 | Freescale Semiconductor, Inc. | Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing |
-
1985
- 1985-09-26 JP JP1985146750U patent/JPH0333068Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6255354U (de) | 1987-04-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6198163B1 (en) | Thin leadframe-type semiconductor package having heat sink with recess and exposed surface | |
| US6790710B2 (en) | Method of manufacturing an integrated circuit package | |
| TWI453838B (zh) | 具有散熱器之無引線封裝 | |
| US7489021B2 (en) | Lead frame with included passive devices | |
| JP2005191240A (ja) | 半導体装置及びその製造方法 | |
| JPH11514149A (ja) | 熱特性が改善された電子パッケージ | |
| US5299091A (en) | Packaged semiconductor device having heat dissipation/electrical connection bumps and method of manufacturing same | |
| US6798046B1 (en) | Semiconductor package including ring structure connected to leads with vertically downset inner ends | |
| JP2000003988A (ja) | リードフレームおよび半導体装置 | |
| US6661081B2 (en) | Semiconductor device and its manufacturing method | |
| US20220157700A1 (en) | Two sided bondable lead frame | |
| KR100621555B1 (ko) | 리드 프레임, 이를 이용한 반도체 칩 패키지 및 그의 제조방법 | |
| JPS60167454A (ja) | 半導体装置 | |
| TWI274406B (en) | Dual gauge leadframe | |
| JP2651427B2 (ja) | 半導体装置の製造方法 | |
| JPH0333068Y2 (de) | ||
| JPH03174749A (ja) | 半導体装置 | |
| JPH0228356A (ja) | 表面実装型半導体装置及びその製造方法 | |
| JPH04155949A (ja) | 樹脂封止型半導体装置 | |
| JPH05243326A (ja) | 半導体装置 | |
| KR100252862B1 (ko) | 반도체 패키지 및 그의 제조방법 | |
| JPH03237747A (ja) | 半導体装置 | |
| JPS6244545Y2 (de) | ||
| JPS6331394Y2 (de) | ||
| JPH04196471A (ja) | 半導体装置 |