JPH0332925B2 - - Google Patents
Info
- Publication number
- JPH0332925B2 JPH0332925B2 JP59105614A JP10561484A JPH0332925B2 JP H0332925 B2 JPH0332925 B2 JP H0332925B2 JP 59105614 A JP59105614 A JP 59105614A JP 10561484 A JP10561484 A JP 10561484A JP H0332925 B2 JPH0332925 B2 JP H0332925B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- vibrator
- material layer
- attaching
- crystal resonator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 87
- 239000013078 crystal Substances 0.000 claims description 52
- 239000004020 conductor Substances 0.000 claims description 46
- 239000000463 material Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 19
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 14
- 229910052709 silver Inorganic materials 0.000 claims description 14
- 239000004332 silver Substances 0.000 claims description 14
- 230000008018 melting Effects 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 230000004907 flux Effects 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 9
- 239000011521 glass Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000615 nonconductor Substances 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 235000011837 pasties Nutrition 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/0504—Holders or supports for bulk acoustic wave devices
- H03H9/0514—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59105614A JPS60249410A (ja) | 1984-05-24 | 1984-05-24 | 振動子の取り付け方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59105614A JPS60249410A (ja) | 1984-05-24 | 1984-05-24 | 振動子の取り付け方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60249410A JPS60249410A (ja) | 1985-12-10 |
| JPH0332925B2 true JPH0332925B2 (enrdf_load_stackoverflow) | 1991-05-15 |
Family
ID=14412374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59105614A Granted JPS60249410A (ja) | 1984-05-24 | 1984-05-24 | 振動子の取り付け方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60249410A (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02305209A (ja) * | 1989-05-19 | 1990-12-18 | Matsushita Electric Ind Co Ltd | 圧電磁器共振子 |
| JP2669099B2 (ja) * | 1990-03-23 | 1997-10-27 | 株式会社村田製作所 | ３次高調波利用発振子およびその製造方法 |
| JP2562661Y2 (ja) * | 1992-10-13 | 1998-02-16 | 株式会社村田製作所 | 圧電素子の実装構造 |
| JP3519094B2 (ja) * | 1993-01-11 | 2004-04-12 | 花王株式会社 | 吸収体の製造方法及びその製造装置 |
-
1984
- 1984-05-24 JP JP59105614A patent/JPS60249410A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60249410A (ja) | 1985-12-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2772739B2 (ja) | リードレスパッケージの外部電極構造及びその製造方法 | |
| US3497774A (en) | Electrical circuit module and method of manufacture | |
| GB2062963A (en) | Semiconductor chip mountings | |
| US3495133A (en) | Circuit structure including semiconductive chip devices joined to a substrate by solder contacts | |
| JPH06302650A (ja) | 半導体装置 | |
| JPH08288637A (ja) | 電子部品および電子部品の半田付け方法 | |
| JPH0332925B2 (enrdf_load_stackoverflow) | ||
| CN218499349U (zh) | Bga芯片固定结构 | |
| JP2650499B2 (ja) | 電気的接続接点の形成方法および電子部品の実装方法 | |
| JPH0878837A (ja) | 実装ハンダ付け工法及び実装ハンダ付け済みプリント基板 | |
| JP3099768B2 (ja) | 電子部品組立体およびその製造方法 | |
| JP2000151085A (ja) | 電子回路装置及び電子部品の配線基板実装方法 | |
| JPH08316619A (ja) | プリント配線板及びその製造方法 | |
| JP2705653B2 (ja) | 電子デバイス組立体およびその製造方法 | |
| JPH0349211A (ja) | 電子部品 | |
| JP3013682B2 (ja) | 半田バンプならびにこれを用いた電子部品の接続構造および方法 | |
| JPH1140716A (ja) | 半導体装置およびその製造方法 | |
| JPH05190553A (ja) | 半導体部品の実装構造及びその半田バンプの製造方法 | |
| JPH07335679A (ja) | アルミポストのはんだ付け構造 | |
| JP3321358B2 (ja) | 半導体装置 | |
| JPH08293664A (ja) | 半田ボールの形成方法 | |
| JPH0349466Y2 (enrdf_load_stackoverflow) | ||
| JPH07122846A (ja) | 微小表面実装部品のハンダ付け方法 | |
| JP3373274B2 (ja) | 半導体装置 | |
| JP2751897B2 (ja) | ボールグリッドアレイ実装構造及び実装方法 |