JPH0332914B2 - - Google Patents

Info

Publication number
JPH0332914B2
JPH0332914B2 JP59171937A JP17193784A JPH0332914B2 JP H0332914 B2 JPH0332914 B2 JP H0332914B2 JP 59171937 A JP59171937 A JP 59171937A JP 17193784 A JP17193784 A JP 17193784A JP H0332914 B2 JPH0332914 B2 JP H0332914B2
Authority
JP
Japan
Prior art keywords
semiconductor element
lead group
electrode
substrate
protrusions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59171937A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6149432A (ja
Inventor
Kenzo Hatada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP59171937A priority Critical patent/JPS6149432A/ja
Publication of JPS6149432A publication Critical patent/JPS6149432A/ja
Priority to US07/040,769 priority patent/US4784972A/en
Publication of JPH0332914B2 publication Critical patent/JPH0332914B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/60—
    • H10W70/093—
    • H10W70/682—
    • H10W72/01204—
    • H10W72/252—
    • H10W72/874—
    • H10W90/00—

Landscapes

  • Wire Bonding (AREA)
JP59171937A 1984-08-18 1984-08-18 半導体装置の製造方法 Granted JPS6149432A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP59171937A JPS6149432A (ja) 1984-08-18 1984-08-18 半導体装置の製造方法
US07/040,769 US4784972A (en) 1984-08-18 1987-04-17 Method of joining beam leads with projections to device electrodes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59171937A JPS6149432A (ja) 1984-08-18 1984-08-18 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6149432A JPS6149432A (ja) 1986-03-11
JPH0332914B2 true JPH0332914B2 (index.php) 1991-05-15

Family

ID=15932589

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59171937A Granted JPS6149432A (ja) 1984-08-18 1984-08-18 半導体装置の製造方法

Country Status (2)

Country Link
US (1) US4784972A (index.php)
JP (1) JPS6149432A (index.php)

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JPS63160352A (ja) * 1986-12-24 1988-07-04 Semiconductor Energy Lab Co Ltd 半導体装置の実装方法
JPH0793390B2 (ja) * 1987-01-16 1995-10-09 日本電気株式会社 Ｉｃカード等のための薄型構造の紫外線透過型半導体装置パッケージ
JP2674786B2 (ja) * 1988-07-06 1997-11-12 ローム株式会社 Ｉｃの実装方法および実装装置
DE3829538A1 (de) * 1988-08-31 1990-03-08 Siemens Ag Verfahren zum verbinden eines halbleiterchips mit einem substrat
US5071787A (en) * 1989-03-14 1991-12-10 Kabushiki Kaisha Toshiba Semiconductor device utilizing a face-down bonding and a method for manufacturing the same
US5164336A (en) * 1989-09-11 1992-11-17 Nippon Steel Corporation Method of connecting tab tape to semiconductor chip, and bump sheet and bumped tape used in the method
US5270260A (en) * 1990-08-23 1993-12-14 Siemens Aktiengesellschaft Method and apparatus for connecting a semiconductor chip to a carrier system
US5591149A (en) * 1992-10-07 1997-01-07 The Procter & Gamble Company Absorbent article having meltblown components
US5097101A (en) * 1991-02-05 1992-03-17 Tektronix, Inc. Method of forming a conductive contact bump on a flexible substrate and a flexible substrate
JPH0779191B2 (ja) * 1991-04-08 1995-08-23 株式会社東芝 立体配線板の製造方法
US5151388A (en) * 1991-05-07 1992-09-29 Hughes Aircraft Company Flip interconnect
US5681300A (en) * 1991-12-17 1997-10-28 The Procter & Gamble Company Absorbent article having blended absorbent core
US5316105A (en) * 1993-03-03 1994-05-31 Reggin Robert F Portable tree stand for deer hunting
US7073254B2 (en) * 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
WO1996015551A1 (en) * 1994-11-15 1996-05-23 Formfactor, Inc. Mounting electronic components to a circuit board
US20070228110A1 (en) * 1993-11-16 2007-10-04 Formfactor, Inc. Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out
US6835898B2 (en) 1993-11-16 2004-12-28 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
WO1995028740A1 (en) * 1994-04-14 1995-10-26 Olin Corporation Electronic package having improved wire bonding capability
US5686353A (en) * 1994-12-26 1997-11-11 Matsushita Electric Industrial Co., Ltd. Semiconductor device and manufacturing method thereof
US20100065963A1 (en) * 1995-05-26 2010-03-18 Formfactor, Inc. Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US6880245B2 (en) * 1996-03-12 2005-04-19 International Business Machines Corporation Method for fabricating a structure for making contact with an IC device
JPH10303252A (ja) * 1997-04-28 1998-11-13 Nec Kansai Ltd 半導体装置
US6117299A (en) * 1997-05-09 2000-09-12 Mcnc Methods of electroplating solder bumps of uniform height on integrated circuit substrates
US6441315B1 (en) 1998-11-10 2002-08-27 Formfactor, Inc. Contact structures with blades having a wiping motion
US6405429B1 (en) * 1999-08-26 2002-06-18 Honeywell Inc. Microbeam assembly and associated method for integrated circuit interconnection to substrates
US7262611B2 (en) 2000-03-17 2007-08-28 Formfactor, Inc. Apparatuses and methods for planarizing a semiconductor contactor
US6729019B2 (en) 2001-07-11 2004-05-04 Formfactor, Inc. Method of manufacturing a probe card
US7084650B2 (en) * 2002-12-16 2006-08-01 Formfactor, Inc. Apparatus and method for limiting over travel in a probe card assembly
DE102006009723A1 (de) * 2006-03-02 2007-09-06 Siemens Ag Verfahren zum Herstellen und planaren Kontaktieren einer elektronischen Vorrichtung und entsprechend hergestellte Vorrichtung
US7528618B2 (en) * 2006-05-02 2009-05-05 Formfactor, Inc. Extended probe tips
US8742602B2 (en) * 2007-03-16 2014-06-03 Invensas Corporation Vertical electrical interconnect formed on support prior to die mount
US8723332B2 (en) * 2007-06-11 2014-05-13 Invensas Corporation Electrically interconnected stacked die assemblies
US8704379B2 (en) * 2007-09-10 2014-04-22 Invensas Corporation Semiconductor die mount by conformal die coating
KR101554761B1 (ko) 2008-03-12 2015-09-21 인벤사스 코포레이션 지지부에 실장되는 전기적으로 인터커넥트된 다이 조립체
US7863159B2 (en) * 2008-06-19 2011-01-04 Vertical Circuits, Inc. Semiconductor die separation method
US9153517B2 (en) 2008-05-20 2015-10-06 Invensas Corporation Electrical connector between die pad and z-interconnect for stacked die assemblies
US9006028B2 (en) * 2008-09-12 2015-04-14 Ananda H. Kumar Methods for forming ceramic substrates with via studs
US8148646B2 (en) * 2008-09-29 2012-04-03 Formfactor, Inc. Process of positioning groups of contact structures
WO2010151578A2 (en) * 2009-06-26 2010-12-29 Vertical Circuits, Inc. Electrical interconnect for die stacked in zig-zag configuration
WO2011056668A2 (en) 2009-10-27 2011-05-12 Vertical Circuits, Inc. Selective die electrical insulation additive process
TWI544604B (zh) 2009-11-04 2016-08-01 英維瑟斯公司 具有降低應力電互連的堆疊晶粒總成
WO2015178296A1 (ja) * 2014-05-20 2015-11-26 三菱電機株式会社 電力用半導体装置
US9490195B1 (en) 2015-07-17 2016-11-08 Invensas Corporation Wafer-level flipped die stacks with leadframes or metal foil interconnects
US9871019B2 (en) 2015-07-17 2018-01-16 Invensas Corporation Flipped die stack assemblies with leadframe interconnects
US9825002B2 (en) 2015-07-17 2017-11-21 Invensas Corporation Flipped die stack
US9508691B1 (en) 2015-12-16 2016-11-29 Invensas Corporation Flipped die stacks with multiple rows of leadframe interconnects
US10566310B2 (en) 2016-04-11 2020-02-18 Invensas Corporation Microelectronic packages having stacked die and wire bond interconnects
US9595511B1 (en) 2016-05-12 2017-03-14 Invensas Corporation Microelectronic packages and assemblies with improved flyby signaling operation
US9728524B1 (en) 2016-06-30 2017-08-08 Invensas Corporation Enhanced density assembly having microelectronic packages mounted at substantial angle to board

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JPS557022B1 (index.php) * 1968-05-10 1980-02-21
US3599056A (en) * 1969-06-11 1971-08-10 Bell Telephone Labor Inc Semiconductor beam lead with thickened bonding portion
US3634930A (en) * 1969-06-12 1972-01-18 Western Electric Co Methods for bonding leads and testing bond strength
US3760238A (en) * 1972-02-28 1973-09-18 Microsystems Int Ltd Fabrication of beam leads
US3859723A (en) * 1973-11-05 1975-01-14 Microsystems Int Ltd Bonding method for multiple chip arrays
US3984620A (en) * 1975-06-04 1976-10-05 Raytheon Company Integrated circuit chip test and assembly package
US3971428A (en) * 1975-10-17 1976-07-27 The United States Of America As Represented By The Secretary Of The Navy Method for making beam leads
US4052787A (en) * 1975-12-18 1977-10-11 Rockwell International Corporation Method of fabricating a beam lead flexible circuit
US4022641A (en) * 1976-04-02 1977-05-10 The United States Of America As Represented By The Secretary Of The Navy Method for making beam leads for ceramic substrates
IT1094628B (it) * 1977-06-06 1985-08-02 Rca Corp Metodo di fabbricazione di dispositivi semiconduttori
US4312117A (en) * 1977-09-01 1982-01-26 Raytheon Company Integrated test and assembly device
US4179802A (en) * 1978-03-27 1979-12-25 International Business Machines Corporation Studded chip attachment process
JPS5917981B2 (ja) * 1979-07-02 1984-04-24 セイコーエプソン株式会社 基板導体層への突起製造方法
JPS5637499A (en) * 1979-08-31 1981-04-11 Toshiba Corp Heat exchanger
JPS604278B2 (ja) * 1980-02-26 1985-02-02 良夫 名取 電気メッキ法
JPS57152147A (en) * 1981-03-16 1982-09-20 Matsushita Electric Ind Co Ltd Formation of metal projection on metal lead
DE3208081A1 (de) * 1982-03-06 1983-09-08 Braun Ag, 6000 Frankfurt Verfahren zur herstellung einer siebartigen scherfolie fuer einen elektrisch betriebenen trockenrasierapparat mit erhebungen auf ihrer der haut zugewandten flaeche
FR2524707B1 (fr) * 1982-04-01 1985-05-31 Cit Alcatel Procede d'encapsulation de composants semi-conducteurs, et composants encapsules obtenus
JPS629642A (ja) * 1985-07-05 1987-01-17 Matsushita Electric Ind Co Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS6149432A (ja) 1986-03-11
US4784972A (en) 1988-11-15

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