JPH0332465U - - Google Patents
Info
- Publication number
- JPH0332465U JPH0332465U JP1989092987U JP9298789U JPH0332465U JP H0332465 U JPH0332465 U JP H0332465U JP 1989092987 U JP1989092987 U JP 1989092987U JP 9298789 U JP9298789 U JP 9298789U JP H0332465 U JPH0332465 U JP H0332465U
- Authority
- JP
- Japan
- Prior art keywords
- board
- double
- thickness
- conductive ink
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003014 reinforcing effect Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 2
- 238000010292 electrical insulation Methods 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 230000002787 reinforcement Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0221—Perforating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989092987U JPH0635499Y2 (ja) | 1989-08-09 | 1989-08-09 | 両面プリント基板 |
KR2019890016706U KR920002343Y1 (ko) | 1989-08-09 | 1989-11-13 | 양면 프린트 기판 |
GB9017182A GB2235825A (en) | 1989-08-09 | 1990-08-06 | Double-sided composite printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989092987U JPH0635499Y2 (ja) | 1989-08-09 | 1989-08-09 | 両面プリント基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0332465U true JPH0332465U (sh) | 1991-03-29 |
JPH0635499Y2 JPH0635499Y2 (ja) | 1994-09-14 |
Family
ID=14069727
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989092987U Expired - Lifetime JPH0635499Y2 (ja) | 1989-08-09 | 1989-08-09 | 両面プリント基板 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPH0635499Y2 (sh) |
KR (1) | KR920002343Y1 (sh) |
GB (1) | GB2235825A (sh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2008023506A1 (ja) * | 2006-08-02 | 2010-01-07 | 株式会社村田製作所 | チップ素子 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6185893A (ja) * | 1984-10-04 | 1986-05-01 | 横浜ゴム株式会社 | 可撓性フイルムへの電子回路印刷法 |
JPS6187392A (ja) * | 1984-10-05 | 1986-05-02 | 横浜ゴム株式会社 | 可撓性プリント配線板の製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS556832A (en) * | 1978-06-29 | 1980-01-18 | Nippon Mektron Kk | Method of manufacturing flexible circuit substrate |
JPS57193094A (en) * | 1981-05-18 | 1982-11-27 | Matsushita Electric Ind Co Ltd | Electronic circuit part and method of mounting same |
GB2101411B (en) * | 1981-06-04 | 1985-06-05 | Standard Telephones Cables Ltd | Flexi-rigid printed circuit boards |
JPS60149196A (ja) * | 1984-01-17 | 1985-08-06 | ソニー株式会社 | プリント基板およびその製造方法 |
DE3429236A1 (de) * | 1984-08-08 | 1986-02-13 | Krone Gmbh, 1000 Berlin | Folie mit beidseitig aufgedruckten elektrischen leiterbahnen |
GB2219892B (en) * | 1988-06-16 | 1992-07-15 | Plessey Co Plc | A circuit board laminate and method of providing same |
-
1989
- 1989-08-09 JP JP1989092987U patent/JPH0635499Y2/ja not_active Expired - Lifetime
- 1989-11-13 KR KR2019890016706U patent/KR920002343Y1/ko active IP Right Grant
-
1990
- 1990-08-06 GB GB9017182A patent/GB2235825A/en not_active Withdrawn
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6185893A (ja) * | 1984-10-04 | 1986-05-01 | 横浜ゴム株式会社 | 可撓性フイルムへの電子回路印刷法 |
JPS6187392A (ja) * | 1984-10-05 | 1986-05-02 | 横浜ゴム株式会社 | 可撓性プリント配線板の製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2008023506A1 (ja) * | 2006-08-02 | 2010-01-07 | 株式会社村田製作所 | チップ素子 |
JP4561836B2 (ja) * | 2006-08-02 | 2010-10-13 | 株式会社村田製作所 | チップ素子 |
Also Published As
Publication number | Publication date |
---|---|
KR910010399U (ko) | 1991-06-29 |
JPH0635499Y2 (ja) | 1994-09-14 |
GB9017182D0 (en) | 1990-09-19 |
GB2235825A (en) | 1991-03-13 |
KR920002343Y1 (ko) | 1992-04-09 |
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