JPH0332465U - - Google Patents

Info

Publication number
JPH0332465U
JPH0332465U JP1989092987U JP9298789U JPH0332465U JP H0332465 U JPH0332465 U JP H0332465U JP 1989092987 U JP1989092987 U JP 1989092987U JP 9298789 U JP9298789 U JP 9298789U JP H0332465 U JPH0332465 U JP H0332465U
Authority
JP
Japan
Prior art keywords
board
double
thickness
conductive ink
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989092987U
Other languages
Japanese (ja)
Other versions
JPH0635499Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989092987U priority Critical patent/JPH0635499Y2/en
Priority to KR2019890016706U priority patent/KR920002343Y1/en
Priority to GB9017182A priority patent/GB2235825A/en
Publication of JPH0332465U publication Critical patent/JPH0332465U/ja
Application granted granted Critical
Publication of JPH0635499Y2 publication Critical patent/JPH0635499Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0221—Perforating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の両面プリント基板の構成部材
を分解して示す斜視図、第２図は完成品を補強板
の当接面側から捕らえた斜視図、第３図は導通部
を示す拡大斜視図、第４図は従来構造の基板を示
す斜視図、第５図は従来構造における導通部の導
通作業を示す一部を切欠した拡大斜視図である。 １……基板、１ａ，１ｂ……電気回路、２……
導通部、２１……導通用の孔、３……導通用のイ
ンク、４……押し込み用のピン、５……端子接続
部、６……補強板、６１……透孔。 Figure 1 is an exploded perspective view of the components of the double-sided printed circuit board of the present invention, Figure 2 is a perspective view of the completed product viewed from the contact surface of the reinforcing plate, and Figure 3 is an enlarged view showing the conductive part. FIG. 4 is a perspective view showing a board with a conventional structure, and FIG. 5 is a partially cutaway enlarged perspective view showing a conduction operation of a conductive portion in the conventional structure. 1... Board, 1a, 1b... Electric circuit, 2...
Conductive part, 21... Hole for electrical continuity, 3... Ink for electrical continuity, 4... Pin for pushing, 5... Terminal connection part, 6... Reinforcement plate, 61... Through hole.

Claims (1)

【実用新案登録請求の範囲】 (1) 電気絶縁性を有し、表裏両面にエツチング
手段等により電気回路を表示形成する基板の板厚
をそれ自体では独立して強度を維持することがで
きないような肉薄のものとし、前記する基板の片
側面に形成した電気回路の導通部に導通用のイン
クを印刷した場合にその印刷された導通用のイン
クが印刷と同時に基板の裏面に形成したもう一つ
の電気回路に達することができるように構成し、
次いでこれらの印刷手段が完了した後に前記した
基板素材の片面に、適宜位置に端子接続用の透孔
を穿設した補強用の板材を当接一体化させること
によつて基板自体が独立して強度を維持できるよ
うに構成してなる両面プリン基板の構造。 (2) 使用する基板の厚さが０．６mm厚以下のも
のである実用新案登録請求の範囲第１項記載の両
面プリント基板。[Scope of Claim for Utility Model Registration] (1) The thickness of the board that has electrical insulation properties and on which electric circuits are displayed by means of etching or the like on both the front and back sides cannot be maintained independently by itself. If a conductive ink is printed on the conductive part of the electric circuit formed on one side of the board, the printed conductive ink will be applied to the other part formed on the back side of the board at the same time as printing. configured so that one electrical circuit can be reached,
Next, after these printing steps are completed, a reinforcing plate material with through holes for connecting terminals at appropriate positions is brought into contact with and integrated with one side of the above-mentioned board material, so that the board itself becomes independent. Double-sided printed circuit board structure designed to maintain strength. (2) The double-sided printed circuit board according to claim 1, wherein the thickness of the substrate used is 0.6 mm or less.
JP1989092987U 1989-08-09 1989-08-09 Double sided printed circuit board Expired - Lifetime JPH0635499Y2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1989092987U JPH0635499Y2 (en) 1989-08-09 1989-08-09 Double sided printed circuit board
KR2019890016706U KR920002343Y1 (en) 1989-08-09 1989-11-13 Two-sided printed circuit board
GB9017182A GB2235825A (en) 1989-08-09 1990-08-06 Double-sided composite printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989092987U JPH0635499Y2 (en) 1989-08-09 1989-08-09 Double sided printed circuit board

Publications (2)

Publication Number Publication Date
JPH0332465U true JPH0332465U (en) 1991-03-29
JPH0635499Y2 JPH0635499Y2 (en) 1994-09-14

Family

ID=14069727

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989092987U Expired - Lifetime JPH0635499Y2 (en) 1989-08-09 1989-08-09 Double sided printed circuit board

Country Status (3)

Country Link
JP (1) JPH0635499Y2 (en)
KR (1) KR920002343Y1 (en)
GB (1) GB2235825A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2008023506A1 (en) * 2006-08-02 2010-01-07 株式会社村田製作所 Chip element

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6185893A (en) * 1984-10-04 1986-05-01 横浜ゴム株式会社 Electronic circuit printing for flexible film
JPS6187392A (en) * 1984-10-05 1986-05-02 横浜ゴム株式会社 Manufacture of flexible printed circuit board

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS556832A (en) * 1978-06-29 1980-01-18 Nippon Mektron Kk Method of manufacturing flexible circuit substrate
JPS57193094A (en) * 1981-05-18 1982-11-27 Matsushita Electric Ind Co Ltd Electronic circuit part and method of mounting same
GB2101411B (en) * 1981-06-04 1985-06-05 Standard Telephones Cables Ltd Flexi-rigid printed circuit boards
JPS60149196A (en) * 1984-01-17 1985-08-06 ソニー株式会社 Printed board and method of producing same
DE3429236A1 (en) * 1984-08-08 1986-02-13 Krone Gmbh, 1000 Berlin FILM WITH ELECTRICAL LEADS PRINTED ON SIDE SIDE
GB2219892B (en) * 1988-06-16 1992-07-15 Plessey Co Plc A circuit board laminate and method of providing same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6185893A (en) * 1984-10-04 1986-05-01 横浜ゴム株式会社 Electronic circuit printing for flexible film
JPS6187392A (en) * 1984-10-05 1986-05-02 横浜ゴム株式会社 Manufacture of flexible printed circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2008023506A1 (en) * 2006-08-02 2010-01-07 株式会社村田製作所 Chip element
JP4561836B2 (en) * 2006-08-02 2010-10-13 株式会社村田製作所 Chip element

Also Published As

Publication number Publication date
KR920002343Y1 (en) 1992-04-09
GB2235825A (en) 1991-03-13
JPH0635499Y2 (en) 1994-09-14
KR910010399U (en) 1991-06-29
GB9017182D0 (en) 1990-09-19

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