JPH0332465U - - Google Patents

Info

Publication number
JPH0332465U
JPH0332465U JP1989092987U JP9298789U JPH0332465U JP H0332465 U JPH0332465 U JP H0332465U JP 1989092987 U JP1989092987 U JP 1989092987U JP 9298789 U JP9298789 U JP 9298789U JP H0332465 U JPH0332465 U JP H0332465U
Authority
JP
Japan
Prior art keywords
board
double
thickness
conductive ink
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989092987U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0635499Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989092987U priority Critical patent/JPH0635499Y2/ja
Priority to KR2019890016706U priority patent/KR920002343Y1/ko
Priority to GB9017182A priority patent/GB2235825A/en
Publication of JPH0332465U publication Critical patent/JPH0332465U/ja
Application granted granted Critical
Publication of JPH0635499Y2 publication Critical patent/JPH0635499Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0221—Perforating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP1989092987U 1989-08-09 1989-08-09 両面プリント基板 Expired - Lifetime JPH0635499Y2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1989092987U JPH0635499Y2 (ja) 1989-08-09 1989-08-09 両面プリント基板
KR2019890016706U KR920002343Y1 (ko) 1989-08-09 1989-11-13 양면 프린트 기판
GB9017182A GB2235825A (en) 1989-08-09 1990-08-06 Double-sided composite printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989092987U JPH0635499Y2 (ja) 1989-08-09 1989-08-09 両面プリント基板

Publications (2)

Publication Number Publication Date
JPH0332465U true JPH0332465U (cs) 1991-03-29
JPH0635499Y2 JPH0635499Y2 (ja) 1994-09-14

Family

ID=14069727

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989092987U Expired - Lifetime JPH0635499Y2 (ja) 1989-08-09 1989-08-09 両面プリント基板

Country Status (3)

Country Link
JP (1) JPH0635499Y2 (cs)
KR (1) KR920002343Y1 (cs)
GB (1) GB2235825A (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2008023506A1 (ja) * 2006-08-02 2010-01-07 株式会社村田製作所 チップ素子

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6185893A (ja) * 1984-10-04 1986-05-01 横浜ゴム株式会社 可撓性フイルムへの電子回路印刷法
JPS6187392A (ja) * 1984-10-05 1986-05-02 横浜ゴム株式会社 可撓性プリント配線板の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS556832A (en) * 1978-06-29 1980-01-18 Nippon Mektron Kk Method of manufacturing flexible circuit substrate
JPS57193094A (en) * 1981-05-18 1982-11-27 Matsushita Electric Ind Co Ltd Electronic circuit part and method of mounting same
GB2101411B (en) * 1981-06-04 1985-06-05 Standard Telephones Cables Ltd Flexi-rigid printed circuit boards
JPS60149196A (ja) * 1984-01-17 1985-08-06 ソニー株式会社 プリント基板およびその製造方法
DE3429236A1 (de) * 1984-08-08 1986-02-13 Krone Gmbh, 1000 Berlin Folie mit beidseitig aufgedruckten elektrischen leiterbahnen
GB2219892B (en) * 1988-06-16 1992-07-15 Plessey Co Plc A circuit board laminate and method of providing same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6185893A (ja) * 1984-10-04 1986-05-01 横浜ゴム株式会社 可撓性フイルムへの電子回路印刷法
JPS6187392A (ja) * 1984-10-05 1986-05-02 横浜ゴム株式会社 可撓性プリント配線板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2008023506A1 (ja) * 2006-08-02 2010-01-07 株式会社村田製作所 チップ素子
JP4561836B2 (ja) * 2006-08-02 2010-10-13 株式会社村田製作所 チップ素子

Also Published As

Publication number Publication date
GB2235825A (en) 1991-03-13
KR910010399U (ko) 1991-06-29
JPH0635499Y2 (ja) 1994-09-14
GB9017182D0 (en) 1990-09-19
KR920002343Y1 (ko) 1992-04-09

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