JPH0331789B2 - - Google Patents
Info
- Publication number
- JPH0331789B2 JPH0331789B2 JP52063337A JP6333777A JPH0331789B2 JP H0331789 B2 JPH0331789 B2 JP H0331789B2 JP 52063337 A JP52063337 A JP 52063337A JP 6333777 A JP6333777 A JP 6333777A JP H0331789 B2 JPH0331789 B2 JP H0331789B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- concentration
- plating
- solution
- ions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010949 copper Substances 0.000 claims description 49
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 48
- 229910001431 copper ion Inorganic materials 0.000 claims description 48
- 238000007747 plating Methods 0.000 claims description 48
- 229910052802 copper Inorganic materials 0.000 claims description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 31
- 239000000126 substance Substances 0.000 claims description 22
- 239000002738 chelating agent Substances 0.000 claims description 21
- 238000001514 detection method Methods 0.000 claims description 12
- 230000000087 stabilizing effect Effects 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 7
- 239000013522 chelant Substances 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- 150000002500 ions Chemical class 0.000 claims description 5
- 238000000605 extraction Methods 0.000 claims description 2
- 238000005554 pickling Methods 0.000 claims 1
- 239000000243 solution Substances 0.000 description 27
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 19
- 238000000034 method Methods 0.000 description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- 239000008139 complexing agent Substances 0.000 description 6
- 238000004448 titration Methods 0.000 description 6
- 229920006395 saturated elastomer Polymers 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 238000005070 sampling Methods 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- -1 iron ions Chemical class 0.000 description 2
- 238000007726 management method Methods 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical compound [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 description 1
- KCQUJORJVXQRST-UHFFFAOYSA-N acetic acid;ethane-1,2-diamine Chemical compound CC(O)=O.CC(O)=O.CC(O)=O.CC(O)=O.CC(O)=O.NCCN KCQUJORJVXQRST-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000004737 colorimetric analysis Methods 0.000 description 1
- 230000009918 complex formation Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 235000009508 confectionery Nutrition 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003002 pH adjusting agent Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003918 potentiometric titration Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
Landscapes
- Chemically Coating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6333777A JPS53149389A (en) | 1977-06-01 | 1977-06-01 | Measurement method of copper ions and chelating agent concentration in chemical copper plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6333777A JPS53149389A (en) | 1977-06-01 | 1977-06-01 | Measurement method of copper ions and chelating agent concentration in chemical copper plating solution |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59137118A Division JPS60104248A (ja) | 1984-07-04 | 1984-07-04 | 化学銅めつき液中のキレ−ト剤濃度測定法 |
| JP59137117A Division JPS60104247A (ja) | 1984-07-04 | 1984-07-04 | 化学銅めつき液中の銅イオンとキレ−ト剤濃度測定装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53149389A JPS53149389A (en) | 1978-12-26 |
| JPH0331789B2 true JPH0331789B2 (de) | 1991-05-08 |
Family
ID=13226314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6333777A Granted JPS53149389A (en) | 1977-06-01 | 1977-06-01 | Measurement method of copper ions and chelating agent concentration in chemical copper plating solution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS53149389A (de) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6890758B2 (en) * | 2003-06-13 | 2005-05-10 | Eci Technology, Inc. | Measurement of complexing agent concentration in an electroless plating bath |
| JP5145511B2 (ja) * | 2007-12-29 | 2013-02-20 | 株式会社シノテスト | 試料中の金属の測定方法 |
| JP6644552B2 (ja) * | 2016-01-07 | 2020-02-12 | 株式会社ニイタカ | キレート剤の定量方法 |
| CN112180029A (zh) * | 2020-09-17 | 2021-01-05 | 大连博融新材料有限公司 | 一种金属铵盐中铵含量的检测方法 |
-
1977
- 1977-06-01 JP JP6333777A patent/JPS53149389A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53149389A (en) | 1978-12-26 |
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