JPH0330441U - - Google Patents
Info
- Publication number
- JPH0330441U JPH0330441U JP9126689U JP9126689U JPH0330441U JP H0330441 U JPH0330441 U JP H0330441U JP 9126689 U JP9126689 U JP 9126689U JP 9126689 U JP9126689 U JP 9126689U JP H0330441 U JPH0330441 U JP H0330441U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor device
- die pad
- lead frame
- pad part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 description 2
- 238000001914 filtration Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例による半導体装置
用リードフレームの平面図、第２図は第１図のリ
ードフレームに半導体装置を実装した状況を示す
平面図、第３図はこの考案の他の実施例による半
導体装置用リードフレームの平面図、第４図は従
来の半導体装置用リードフレームの平面図、第５
図は第４図のリードフレームに半導体装置を実装
した状況を示す平面図、第６図は第４図のリード
フレームに半導体装置を装着するに際して宙釣り
リードにろ―材が流出した状況を示す平面図であ
る。
図において、１……ダイパツド、２……インナ
ーリード、３……宙釣りリード、４……半導体装
置、５……ろ―材、６……金属細線、７……めつ
き末実施範囲、８……突起部である。なお、図中
、同一符号は同一、又は相当部分を示す。
FIG. 1 is a plan view of a lead frame for a semiconductor device according to an embodiment of this invention, FIG. 2 is a plan view showing a situation in which a semiconductor device is mounted on the lead frame of FIG. 1, and FIG. FIG. 4 is a plan view of a conventional lead frame for semiconductor devices, and FIG.
The figure is a plan view showing a situation in which a semiconductor device is mounted on the lead frame shown in Fig. 4, and Fig. 6 shows a situation in which filter material flows out into the suspended lead when the semiconductor device is mounted on the lead frame shown in Fig. 4. FIG. In the figure, 1...Die pad, 2...Inner lead, 3...Hanging lead, 4...Semiconductor device, 5...Filtering material, 6...Thin metal wire, 7...Plating end area, 8 ...It is a protrusion. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
、そのダイパツド部とそれより伸びる宙釣りリー
ドとの間でリード表面に施してあるめつきを分離
している事を特徴とする半導体装置用リードフレ
ーム。 A lead frame for mounting a semiconductor device, characterized in that the plating applied to the lead surface is separated between the die pad part and the suspended lead extending from the die pad part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9126689U JPH0330441U (en) | 1989-08-01 | 1989-08-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9126689U JPH0330441U (en) | 1989-08-01 | 1989-08-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0330441U true JPH0330441U (en) | 1991-03-26 |
Family
ID=31640762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9126689U Pending JPH0330441U (en) | 1989-08-01 | 1989-08-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0330441U (en) |
-
1989
- 1989-08-01 JP JP9126689U patent/JPH0330441U/ja active Pending