JPH0329195B2 - - Google Patents
Info
- Publication number
- JPH0329195B2 JPH0329195B2 JP58039696A JP3969683A JPH0329195B2 JP H0329195 B2 JPH0329195 B2 JP H0329195B2 JP 58039696 A JP58039696 A JP 58039696A JP 3969683 A JP3969683 A JP 3969683A JP H0329195 B2 JPH0329195 B2 JP H0329195B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- piece
- pieces
- emitting diode
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58039696A JPS59165472A (ja) | 1983-03-09 | 1983-03-09 | 発光ダイオ−ドランプ用リ−ド基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58039696A JPS59165472A (ja) | 1983-03-09 | 1983-03-09 | 発光ダイオ−ドランプ用リ−ド基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59165472A JPS59165472A (ja) | 1984-09-18 |
JPH0329195B2 true JPH0329195B2 (enrdf_load_stackoverflow) | 1991-04-23 |
Family
ID=12560187
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58039696A Granted JPS59165472A (ja) | 1983-03-09 | 1983-03-09 | 発光ダイオ−ドランプ用リ−ド基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59165472A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62237797A (ja) * | 1986-04-08 | 1987-10-17 | 日本インター株式会社 | 電子部品の実装方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4054814A (en) * | 1975-10-31 | 1977-10-18 | Western Electric Company, Inc. | Electroluminescent display and method of making |
JPS57211284A (en) * | 1981-06-23 | 1982-12-25 | Toshiba Corp | Lead frame for semiconductor device |
-
1983
- 1983-03-09 JP JP58039696A patent/JPS59165472A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59165472A (ja) | 1984-09-18 |
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