JPH0328509Y2 - - Google Patents
Info
- Publication number
- JPH0328509Y2 JPH0328509Y2 JP18500885U JP18500885U JPH0328509Y2 JP H0328509 Y2 JPH0328509 Y2 JP H0328509Y2 JP 18500885 U JP18500885 U JP 18500885U JP 18500885 U JP18500885 U JP 18500885U JP H0328509 Y2 JPH0328509 Y2 JP H0328509Y2
- Authority
- JP
- Japan
- Prior art keywords
- sealing ring
- semiconductor element
- flange
- electrode
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 40
- 238000007789 sealing Methods 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 241000755266 Kathetostoma giganteum Species 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18500885U JPH0328509Y2 (da) | 1985-11-29 | 1985-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18500885U JPH0328509Y2 (da) | 1985-11-29 | 1985-11-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6292649U JPS6292649U (da) | 1987-06-13 |
| JPH0328509Y2 true JPH0328509Y2 (da) | 1991-06-19 |
Family
ID=31133232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18500885U Expired JPH0328509Y2 (da) | 1985-11-29 | 1985-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0328509Y2 (da) |
-
1985
- 1985-11-29 JP JP18500885U patent/JPH0328509Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6292649U (da) | 1987-06-13 |
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