JPS6292649U - - Google Patents
Info
- Publication number
- JPS6292649U JPS6292649U JP18500885U JP18500885U JPS6292649U JP S6292649 U JPS6292649 U JP S6292649U JP 18500885 U JP18500885 U JP 18500885U JP 18500885 U JP18500885 U JP 18500885U JP S6292649 U JPS6292649 U JP S6292649U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- sealing ring
- electrode
- flange
- anode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 4
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18500885U JPH0328509Y2 (da) | 1985-11-29 | 1985-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18500885U JPH0328509Y2 (da) | 1985-11-29 | 1985-11-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6292649U true JPS6292649U (da) | 1987-06-13 |
| JPH0328509Y2 JPH0328509Y2 (da) | 1991-06-19 |
Family
ID=31133232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18500885U Expired JPH0328509Y2 (da) | 1985-11-29 | 1985-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0328509Y2 (da) |
-
1985
- 1985-11-29 JP JP18500885U patent/JPH0328509Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0328509Y2 (da) | 1991-06-19 |