JPS6292649U - - Google Patents
Info
- Publication number
- JPS6292649U JPS6292649U JP18500885U JP18500885U JPS6292649U JP S6292649 U JPS6292649 U JP S6292649U JP 18500885 U JP18500885 U JP 18500885U JP 18500885 U JP18500885 U JP 18500885U JP S6292649 U JPS6292649 U JP S6292649U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- sealing ring
- electrode
- flange
- anode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 4
Landscapes
- Die Bonding (AREA)
Description
第１図はこの考案の一実施例を示す断面図、第
２図は従来の半導体装置を示す断面図である。
図中、１は半導体素子、５はＯリング、６は皿
ねじ、２０は陰極電極、２０ａは鍔部、３０は陽
極電極、３０ａは鍔部、４０は封止リングである
。尚、図中同一符号は同一又は相当部分を示す。
FIG. 1 is a sectional view showing an embodiment of this invention, and FIG. 2 is a sectional view showing a conventional semiconductor device. In the figure, 1 is a semiconductor element, 5 is an O-ring, 6 is a countersunk screw, 20 is a cathode electrode, 20a is a flange, 30 is an anode electrode, 30a is a flange, and 40 is a sealing ring. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
設けられた陰極電極及び陽極電極と、上記半導体
素子を取り囲んで上記一対の電極と結合される絶
縁筒体とからなる半導体装置において、上記陰極
電極及び陽極電極にはそれぞれ鍔部を設け、これ
ら鍔部と鍔部の間に上記半導体素子を囲繞する絶
縁筒体からなる封止リングを配置し、上記両鍔部
と封止リング両端面との間に弾性絶縁環を配置し
、上記両鍔部と封止リングとをねじにて結合した
ことを特徴とする半導体装置。 In a semiconductor device comprising a semiconductor element, a cathode electrode and an anode electrode provided to sandwich the semiconductor element, and an insulating cylinder surrounding the semiconductor element and coupled to the pair of electrodes, the cathode electrode and the anode Each electrode is provided with a flange, and a sealing ring made of an insulating cylinder surrounding the semiconductor element is arranged between these flange parts, and between both the flange parts and both end surfaces of the sealing ring. 1. A semiconductor device characterized in that an elastic insulating ring is arranged, and both of the flanges and a sealing ring are connected with a screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18500885U JPH0328509Y2 (en) | 1985-11-29 | 1985-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18500885U JPH0328509Y2 (en) | 1985-11-29 | 1985-11-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6292649U true JPS6292649U (en) | 1987-06-13 |
| JPH0328509Y2 JPH0328509Y2 (en) | 1991-06-19 |
Family
ID=31133232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18500885U Expired JPH0328509Y2 (en) | 1985-11-29 | 1985-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0328509Y2 (en) |
-
1985
- 1985-11-29 JP JP18500885U patent/JPH0328509Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0328509Y2 (en) | 1991-06-19 |